Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062635 | Semiconductor device packages including conductors electrically connecting stacked semiconductor devices by extending along surfaces of the semiconductor devices | Po Chih Yang, Yu-Jen Chen, Shih-Wei Liang | 2024-08-13 |
| 11705421 | Apparatus including solder-core connectors and methods of manufacturing the same | Po Chih Yang, Chih-Hong Wang | 2023-07-18 |
| 11171109 | Techniques for forming semiconductor device packages and related packages, intermediate products, and methods | Po Chih Yang, Yu-Jen Chen, Shih-Wei Liang | 2021-11-09 |
| 9922948 | Semiconductor device with modified pad spacing structure | — | 2018-03-20 |
| 9640502 | Stacked semiconductor device | — | 2017-05-02 |