Issued Patents All Time
Showing 1–25 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394686 | Semiconductor structure and manufacturing method thereof | Shou-Zen Chang, Ming-Han Liao | 2025-08-19 |
| 12354921 | Wafer structure including probe marked test pads | Shou-Zen Chang, Ying-Tsung Chu, Ming-Hsun Tsai | 2025-07-08 |
| 12354870 | Multilayer stacking wafer bonding structure and method of manufacturing the same | Shou-Zen Chang | 2025-07-08 |
| 12327777 | Semiconductor package structure and manufacturing method thereof | Shou-Zen Chang, Chi-Ming Chen | 2025-06-10 |
| 12322670 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang | 2025-06-03 |
| 12322691 | Package structure and method of manufacturing the same | Chuei-Tang Wang, Kai-Chiang Wu | 2025-06-03 |
| 12278149 | Through-substrate via test structure | — | 2025-04-15 |
| 12132247 | Semiconductor package and manufacturing method thereof | Yen-Ping Wang, Han-Ping Pu, Kai-Chiang Wu, Chung-Yi Hsu | 2024-10-29 |
| 12119303 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chen-Hua Yu, Han-Ping Pu, Kai-Chiang Wu | 2024-10-15 |
| 12057358 | Package structure with antenna pattern | Sheng-Ta Lin, Kai-Chiang Wu | 2024-08-06 |
| 12046480 | Manufacturing method of a semiconductor device | Shou-Zen Chang, Kai-Chiang Wu, Ching-Feng Yang, Vincent Chen, Chuei-Tang Wang +3 more | 2024-07-23 |
| 11967558 | Wafer stacking structure and manufacturing method thereof | Shou-Zen Chang, Jium Ming Lin | 2024-04-23 |
| 11908787 | Package structure and method of manufacturing the same | Chuei-Tang Wang, Kai-Chiang Wu | 2024-02-20 |
| 11894330 | Methods of manufacturing a semiconductor device including a joint adjacent to a post | Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2024-02-06 |
| 11854992 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Kai-Chiang Wu | 2023-12-26 |
| 11837564 | Semiconductor bonding structure | Shou-Zen Chang, Ying-Tsung Chu, Chi-Ming Chen | 2023-12-05 |
| 11824005 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chen-Hua Yu, Han-Ping Pu, Kai-Chiang Wu | 2023-11-21 |
| 11749648 | Circuit structure for testing through silicon vias in three-dimensional integrated circuit | Shou-Zen Chang, Chun-Cheng Chen | 2023-09-05 |
| 11742219 | Integrated fan-out package and manufacturing method thereof | Kai-Chiang Wu, Chung-Hao Tsai, Yen-Ping Wang, Che-Wei Hsu | 2023-08-29 |
| 11569562 | Semiconductor package and manufacturing method thereof | Yen-Ping Wang, Han-Ping Pu, Kai-Chiang Wu, Chung-Yi Hsu | 2023-01-31 |
| 11569190 | Semiconductor structure and manufacturing method thereof | Kai-Chiang Wu | 2023-01-31 |
| 11424197 | Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same | Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Han-Ping Pu, Kai-Chiang Wu | 2022-08-23 |
| 11398422 | Package structure and fabricating method thereof | Jiun Yi Wu, Kai-Chiang Wu | 2022-07-26 |
| 11362009 | Package structure and method of fabricating the same | Sheng-Ta Lin, Kai-Chiang Wu | 2022-06-14 |
| 11342269 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chen-Hua Yu, Han-Ping Pu, Kai-Chiang Wu | 2022-05-24 |