Issued Patents All Time
Showing 51–75 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381309 | Package structure having connecting module | Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Chao-Wen Shih, Han-Ping Pu +2 more | 2019-08-13 |
| 10276404 | Integrated fan-out package | Kai-Chiang Wu, Chung-Hao Tsai, Yen-Ping Wang, Che-Wei Hsu | 2019-04-30 |
| 10269588 | Integrated circuit underfill scheme | Shih-Wei Liang, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao +1 more | 2019-04-23 |
| 10163846 | Mechanisms for forming hybrid bonding structures with elongated bumps | Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2018-12-25 |
| 10153240 | Method of packaging semiconductor devices | Hsien-Wei Chen, Kai-Chiang Wu, Hung-Jui Kuo | 2018-12-11 |
| 10050013 | Packaged semiconductor devices and packaging methods | Tzu-Chun Tang, Chuei-Tang Wang, Wei-Ting Chen, Vincent Chen, Shou-Zen Chang +1 more | 2018-08-14 |
| 10043761 | Semiconductor device and manufacturing method thereof | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2018-08-07 |
| 10008467 | Semiconductor structure and manufacturing method thereof | Kai-Chiang Wu | 2018-06-26 |
| 9966321 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang | 2018-05-08 |
| 9941140 | Semiconductor devices and methods of manufacture thereof | Yu-Feng Chen, Kai-Chiang Wu, Hung-Jui Kou | 2018-04-10 |
| 9941240 | Semiconductor chip scale package and manufacturing method thereof | Ming-Kai Liu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang, Yen-Ping Wang +1 more | 2018-04-10 |
| 9806045 | Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface | Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2017-10-31 |
| 9659879 | Semiconductor device having a guard ring | Ching-Feng Yang, Kai-Chiang Wu, Vincent Chen | 2017-05-23 |
| 9627325 | Package alignment structure and method of forming same | Ming-Kai Liu, Chia-Chun Miao, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang +1 more | 2017-04-18 |
| 9601439 | Semiconductor structure and manufacturing method thereof | Tzu-Chun Tang, Shou-Zen Chang, Wei-Ting Chen, In-Tsang Lin, Vincent Chen +2 more | 2017-03-21 |
| 9576874 | Semiconductor devices and methods of manufacture thereof | Yu-Feng Chen, Kai-Chiang Wu, Hung-Jui Kuo | 2017-02-21 |
| 9559071 | Mechanisms for forming hybrid bonding structures with elongated bumps | Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2017-01-31 |
| 9497861 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang | 2016-11-15 |
| 9478511 | Methods and apparatus of packaging semiconductor devices | Hsien-Wei Chen, Kai-Chiang Wu, Hung-Jui Kuo | 2016-10-25 |
| 9460989 | Interposer having a defined through via pattern | Shih-Wei Liang, Kai-Chiang Wu, Ming-Kai Liu, Chia-Chun Miao | 2016-10-04 |
| 9412661 | Method for forming package-on-package structure | Ming-Kai Liu, Kai-Chiang Wu, Ching-Feng Yang | 2016-08-09 |
| 9391012 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Hsien-Wei Chen, Yu-Feng Chen, Chun-Hung Lin, Ming-Kai Liu | 2016-07-12 |
| 9355924 | Integrated circuit underfill scheme | Shih-Wei Liang, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao +1 more | 2016-05-31 |
| 9355982 | Semiconductor structure and manufacturing method thereof | Kai-Chiang Wu | 2016-05-31 |
| 9209140 | Semiconductor devices and methods of manufacture thereof | Yu-Feng Chen, Kai-Chiang Wu, Hung-Jui Kuo | 2015-12-08 |