Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10586724 | Fan-out interconnect structure and methods forming the same | Yu-Hsiang Hu, Chung-Shi Liu, Ming-Da Cheng | 2020-03-10 |
| 10297494 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2019-05-21 |
| 10186462 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Yun Chen Hsieh | 2019-01-22 |
| 10049889 | Method of fabricating package structures | Yu-Hsiang Hu, Chung-Shi Liu, Sih-Hao Liao | 2018-08-14 |
| 9941140 | Semiconductor devices and methods of manufacture thereof | Yu-Feng Chen, Kai-Chiang Wu, Chun-Lin Lu | 2018-04-10 |