Issued Patents All Time
Showing 1–25 of 191 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412852 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Ching-Feng Yang, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2025-09-09 |
| 12322691 | Package structure and method of manufacturing the same | Chuei-Tang Wang, Chun-Lin Lu | 2025-06-03 |
| 12322670 | Methods and apparatus for package with interposers | Chun-Lin Lu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang | 2025-06-03 |
| 12266619 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Chung-Shi Liu, Shou-Zen Chang, Chao-Wen Shih | 2025-04-01 |
| 12218035 | Barrier structures between external electrical connectors | Chia-Chun Miao, Shih-Wei Liang | 2025-02-04 |
| 12148692 | Semiconductor package and manufacturing method thereof | Fang-Yu Liang | 2024-11-19 |
| 12132247 | Semiconductor package and manufacturing method thereof | Yen-Ping Wang, Chun-Lin Lu, Han-Ping Pu, Chung-Yi Hsu | 2024-10-29 |
| 12131986 | Semiconductor package and manufacturing method thereof | Tuan-Yu Hung, Ching-Feng Yang, Hung-Jui Kuo, Ming-Che Ho | 2024-10-29 |
| 12119303 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chen-Hua Yu, Chun-Lin Lu, Han-Ping Pu | 2024-10-15 |
| 12080563 | Semiconductor devices and methods of manufacturing | Chien-Hsun Chen, Yu-Min Liang, Yen-Ping Wang, Jiun Yi Wu, Chen-Hua Yu | 2024-09-03 |
| 12062619 | Semiconductor packages and forming methods thereof | Chin-Liang Chen, Jiun Yi Wu, Yen-Ping Wang | 2024-08-13 |
| 12057358 | Package structure with antenna pattern | Sheng-Ta Lin, Chun-Lin Lu | 2024-08-06 |
| 12046480 | Manufacturing method of a semiconductor device | Shou-Zen Chang, Chun-Lin Lu, Ching-Feng Yang, Vincent Chen, Chuei-Tang Wang +3 more | 2024-07-23 |
| 12045493 | Memory apparatus and data rearrangement method for computing in memory | Shu-Ming Liu, Wen Li Tang | 2024-07-23 |
| 12021047 | Semiconductor packages having a die, an encapsulant, and a redistribution structure | Chung-Hao Tsai, Chia-Chia Lin, Chuei-Tang Wang, Chen-Hua Yu | 2024-06-25 |
| 11983267 | Data processing method and circuit thereof based on trojan circuit detection | Jian-Wei Liao, Ting-Yu Lin, Jung-Che Tsai | 2024-05-14 |
| 11977432 | Data processing circuit and fault-mitigating method | Shu-Ming Liu, Jen-ho Kuo, Wen Li Tang | 2024-05-07 |
| 11978526 | Data processing circuit and fault mitigating method | Shu-Ming Liu, Chien-Fa Chen, Wen Li Tang | 2024-05-07 |
| 11973038 | Package structure with improved antenna patterns performance | Fang-Yu Liang | 2024-04-30 |
| 11908787 | Package structure and method of manufacturing the same | Chuei-Tang Wang, Chun-Lin Lu | 2024-02-20 |
| 11894330 | Methods of manufacturing a semiconductor device including a joint adjacent to a post | Chun-Lin Lu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2024-02-06 |
| 11854992 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Chun-Lin Lu | 2023-12-26 |
| 11855011 | Package structure and method of forming the same | Chung-Yi Hsu, Yen-Ping Wang | 2023-12-26 |
| 11824005 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chen-Hua Yu, Chun-Lin Lu, Han-Ping Pu | 2023-11-21 |
| 11749626 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Chung-Shi Liu, Shou-Zen Chang, Chao-Wen Shih | 2023-09-05 |