Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148692 | Semiconductor package and manufacturing method thereof | Kai-Chiang Wu | 2024-11-19 |
| 11973038 | Package structure with improved antenna patterns performance | Kai-Chiang Wu | 2024-04-30 |
| 11682619 | Package component, semiconductor package and manufacturing method thereof | Kai-Chiang Wu | 2023-06-20 |
| 11515274 | Semiconductor package and manufacturing method thereof | Hsiu-Jen Lin, Kai-Chiang Wu, Chih-Chiang Tsao | 2022-11-29 |
| 11374303 | Package structure and method of fabricating the same | Chih-Chiang Tsao | 2022-06-28 |
| 11309242 | Package component, semiconductor package and manufacturing method thereof | Kai-Chiang Wu | 2022-04-19 |
| 11233019 | Manufacturing method of semicondcutor package | Ching-Feng Yang, Kai-Chiang Wu | 2022-01-25 |
| 11094642 | Package structure | Kai-Chiang Wu | 2021-08-17 |
| 10720399 | Semicondcutor package and manufacturing method of semicondcutor package | Ching-Feng Yang, Kai-Chiang Wu | 2020-07-21 |
| 10629539 | Package structure and method of fabricating the same | Kai-Chiang Wu | 2020-04-21 |
| 10199341 | Substrate structure | Hung-Hsien Chang, Yi-Che Lai, Wen-Tsung Tseng, Chen-Yu Huang | 2019-02-05 |
| 10062651 | Packaging substrate and electronic package having the same | Hung-Hsien Chang, Yi-Che Lai, Chang-Fu Lin | 2018-08-28 |
| 10049975 | Substrate structure | Hung-Hsien Chang, Yi-Che Lai, Wen-Tsung Tseng, Chen-Yu Huang | 2018-08-14 |