Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10199341 | Substrate structure | Fang-Yu Liang, Hung-Hsien Chang, Yi-Che Lai, Chen-Yu Huang | 2019-02-05 |
| 10049975 | Substrate structure | Fang-Yu Liang, Hung-Hsien Chang, Yi-Che Lai, Chen-Yu Huang | 2018-08-14 |
| 9899308 | Semiconductor package and method of fabricating the same | Yi-Che Lai, Shih-Kuang Chiu, Mao-Hua Yeh | 2018-02-20 |
| 9607939 | Semiconductor package and method of fabricating the same | Yi-Che Lai, Shih-Kuang Chiu, Mao-Hua Yeh | 2017-03-28 |
| 8987012 | Method of testing a semiconductor package | Pin-Cheng Huang, Chun-Tang Lin, Yi-Che Lai | 2015-03-24 |
| 8895366 | Fabrication method of semiconductor package | Wen-Home Huang, Chang-Fu Lin, Ho-Yi Tsai, Cheng-Hsu Hsiao | 2014-11-25 |
| 8698326 | Semiconductor package and fabrication method thereof | Wen-Home Huang, Chang-Fu Lin, Ho-Yi Tsai, Cheng-Hsu Hsiao | 2014-04-15 |
| 8008769 | Heat-dissipating semiconductor package structure and method for manufacturing the same | Ho-Yi Tsai, Chien-Ping Huang, Cheng-Hsu Hsiao | 2011-08-30 |
| 7889511 | Electronic carrier board applicable to surface mount technology | Fang-Lin Tsai, Ho-Yi Tsai, Chih-Ming Huang | 2011-02-15 |
| 7573722 | Electronic carrier board applicable to surface mounted technology (SMT) | Fang-Lin Tsai, Ho-Yi Tsai, Chih-Ming Huang | 2009-08-11 |