Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1034299 | Illuminated buckle | Chia-Wei Yeh, Juei-Tsung Chen | 2024-07-09 |
| D1020435 | Illuminated buckle | Chia-Wei Yeh, Juei-Tsung Chen | 2024-04-02 |
| 11751642 | Buckle device capable of displaying locked state | Chia-Wei Yeh, Juei-Tsung Chen | 2023-09-12 |
| 11213102 | Buckle device | — | 2022-01-04 |
| 10950507 | Electrical testing method of interposer | Lu-Yi Chen, Chi-Hsin Chiu | 2021-03-16 |
| 10772390 | Buckle device | Po-Tsun Chen, Juei-Tsung Chen | 2020-09-15 |
| 10615055 | Method for fabricating package structure | Chi-Hsin Chiu | 2020-04-07 |
| 10199239 | Package structure and fabrication method thereof | Chi-Hsin Chiu | 2019-02-05 |
| 10049955 | Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layer | Chiang-Cheng Chang, Meng-Tsung Lee, Jung-Pang Huang | 2018-08-14 |
| 9991178 | Interposer and electrical testing method thereof | Lu-Yi Chen, Chi-Hsin Chiu | 2018-06-05 |
| 9899237 | Carrier, semiconductor package and fabrication method thereof | Chiang-Cheng Chang, Meng-Tsung Lee, Jung-Pang Huang | 2018-02-20 |
| 9899308 | Semiconductor package and method of fabricating the same | Wen-Tsung Tseng, Yi-Che Lai, Mao-Hua Yeh | 2018-02-20 |
| 9875981 | Semiconductor device having conductive vias | Meng-Tsung Lee, Yi-Che Lai | 2018-01-23 |
| 9812340 | Method of fabricating semiconductor package having semiconductor element | Chiang-Cheng Chang, Meng-Tsung Lee, Jung-Pang Huang, Fu-Tang Huang | 2017-11-07 |
| 9659806 | Semiconductor package having conductive pillars | Hong-Da Chang | 2017-05-23 |
| 9607939 | Semiconductor package and method of fabricating the same | Wen-Tsung Tseng, Yi-Che Lai, Mao-Hua Yeh | 2017-03-28 |
| 9520304 | Semiconductor package and fabrication method thereof | Hong-Da Chang, Yi-Che Lai, Chi-Hsin Chiu | 2016-12-13 |
| 9502333 | Semiconductor device having conductive vias | Meng-Tsung Lee, Yi-Che Lai | 2016-11-22 |
| 9487393 | Fabrication method of wafer level package having a pressure sensor | Hong-Da Chang, Hsin-Yi Liao, Chun-An Huang, Chien-An Chen | 2016-11-08 |
| 9425119 | Package structure and fabrication method thereof | Hong-Da Chang | 2016-08-23 |
| 9324585 | Semiconductor package and method of fabricating the same | Chiang-Cheng Chang, Meng-Tsung Lee, Jung-Pang Huang, Fu-Tang Huang | 2016-04-26 |
| 9133021 | Wafer level package having a pressure sensor and fabrication method thereof | Hong-Da Chang, Hsin-Yi Liao, Chun-An Huang, Chien-An Chen | 2015-09-15 |
| 9117698 | Fabrication method of semiconductor package | Yan-Heng Chen, Jung-Pang Huang, Hsin-Yi Liao, Guang-Hwa Ma | 2015-08-25 |
| 9041189 | Semiconductor package and method of fabricating the same | Meng-Tsung Lee, Chiang-Cheng Chang | 2015-05-26 |
| 8829672 | Semiconductor package, package structure and fabrication method thereof | Yan-Heng Chen, Jung-Pang Huang, Hsin-Yi Liao, Guang-Hwa Ma | 2014-09-09 |