Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049955 | Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layer | Chiang-Cheng Chang, Meng-Tsung Lee, Shih-Kuang Chiu | 2018-08-14 |
| 9899237 | Carrier, semiconductor package and fabrication method thereof | Chiang-Cheng Chang, Meng-Tsung Lee, Shih-Kuang Chiu | 2018-02-20 |
| 9812340 | Method of fabricating semiconductor package having semiconductor element | Chiang-Cheng Chang, Meng-Tsung Lee, Shih-Kuang Chiu, Fu-Tang Huang | 2017-11-07 |
| 9324585 | Semiconductor package and method of fabricating the same | Chiang-Cheng Chang, Meng-Tsung Lee, Shih-Kuang Chiu, Fu-Tang Huang | 2016-04-26 |
| 9117698 | Fabrication method of semiconductor package | Yan-Heng Chen, Hsin-Yi Liao, Shih-Kuang Chiu, Guang-Hwa Ma | 2015-08-25 |
| 8895367 | Fabrication method of semiconductor package | Hui-Min Huang, Kuan-Wei Chuang, Chun-Tang Lin, Yih-Jenn Jiang | 2014-11-25 |
| 8829672 | Semiconductor package, package structure and fabrication method thereof | Yan-Heng Chen, Hsin-Yi Liao, Shih-Kuang Chiu, Guang-Hwa Ma | 2014-09-09 |
| 8680692 | Carrier, semiconductor package and fabrication method thereof | Chiang-Cheng Chang, Meng-Tsung Lee, Shih-Kuang Chiu | 2014-03-25 |
| 8519526 | Semiconductor package and fabrication method thereof | Hui-Min Huang, Kuan-Wei Chuang, Chun-Tang Lin, Yih-Jenn Jiang | 2013-08-27 |