Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414232 | Substrate structure | Pei-Geng Weng, Fang-Lin Tsai, Wei-Son TSAI | 2025-09-09 |
| 12255182 | Electronic package and manufacturing method thereof | Meng-Huan Chia, Chang-Fu Lin, Don-Son Jiang | 2025-03-18 |
| 12159821 | Electronic package and manufacturing method thereof | Ting-Yang Chou, Don-Son Jiang | 2024-12-03 |
| 11791300 | Electronic package and circuit structure thereof | Fang-Lin Tsai, Chia-Yu Kuo, Pei-Geng Weng, Wei-Son TSAI | 2023-10-17 |
| 11764188 | Electronic package and manufacturing method thereof | Meng-Huan Chia, Chang-Fu Lin, Don-Son Jiang | 2023-09-19 |
| 10192838 | Fabrication method of packaging substrate | Chien-Lung Chuang, Po-Yi Wu, Meng-Tsung Lee | 2019-01-29 |
| 8895367 | Fabrication method of semiconductor package | Jung-Pang Huang, Hui-Min Huang, Kuan-Wei Chuang, Chun-Tang Lin | 2014-11-25 |
| 8519526 | Semiconductor package and fabrication method thereof | Jung-Pang Huang, Hui-Min Huang, Kuan-Wei Chuang, Chun-Tang Lin | 2013-08-27 |
| 7993967 | Semiconductor package fabrication method | Han-Ping Pu, Chien-Ping Huang, Cheng-Hsu Hsiao | 2011-08-09 |
| 7638879 | Semiconductor package and fabrication method thereof | Han-Ping Pu, Chien-Ping Huang, Cheng-Hsu Hsiao | 2009-12-29 |