Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414232 | Substrate structure | Pei-Geng Weng, Wei-Son TSAI, Yih-Jenn Jiang | 2025-09-09 |
| 12334452 | Electronic package and manufacturing method thereof | Chao Pu, Chi-Ching Ho, Yi-Min Fu, Yu-Po Wang | 2025-06-17 |
| 11791300 | Electronic package and circuit structure thereof | Chia-Yu Kuo, Pei-Geng Weng, Wei-Son TSAI, Yih-Jenn Jiang | 2023-10-17 |
| 10396021 | Fabrication method of layer structure for mounting semiconductor device | Yi-Feng Chang, Cheng-Jen Liu, Yi-Min Fu, Hung-Chi Chen | 2019-08-27 |
| 10236261 | Electronic package and method for fabricating the same | Yi-Feng Chang, Lung-Yuan Wang | 2019-03-19 |
| 9972564 | Layer structure for mounting semiconductor device and fabrication method thereof | Yi-Feng Chang, Cheng-Jen Liu, Yi-Min Fu, Hung-Chi Chen | 2018-05-15 |
| 8420521 | Method for fabricating stack structure of semiconductor packages | Ho-Yi Tsai, Han-Ping Pu, Cheng-Hsu Hsiao | 2013-04-16 |
| 8013443 | Electronic carrier board and package structure thereof | Ho-Yi Tsai, Chih-Ming Huang, Chien-Ping Huang | 2011-09-06 |
| 7889511 | Electronic carrier board applicable to surface mount technology | Ho-Yi Tsai, Wen-Tsung Tseng, Chih-Ming Huang | 2011-02-15 |
| 7855443 | Stack structure of semiconductor packages and method for fabricating the stack structure | Ho-Yi Tsai, Han-Ping Pu, Cheng-Hsu Hsiao | 2010-12-21 |
| 7696623 | Electronic carrier board and package structure thereof | Ho-Yi Tsai, Chih-Ming Huang, Chien-Ping Huang | 2010-04-13 |
| 7573722 | Electronic carrier board applicable to surface mounted technology (SMT) | Ho-Yi Tsai, Wen-Tsung Tseng, Chih-Ming Huang | 2009-08-11 |