LW

Lung-Yuan Wang

SC Siliconware Precision Industries Co.: 15 patents #33 of 527Top 7%
Overall (All Time): #284,476 of 4,157,543Top 7%
16
Patents All Time

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDate
12368116 Electronic package and manufacturing method thereof Feng Kao 2025-07-22
12283560 Electronic package including electronic structure and electronic body and manufacturing method thereof Feng Kao 2025-04-22
12114427 Method for fabricating assemble substrate Wen-Liang Lien 2024-10-08
12009340 Method for fabricating electronic package Feng Kao, Mao-Hua Yeh 2024-06-11
11984393 Electronic package, manufacturing method for the same, and electronic structure Feng Kao 2024-05-14
11973047 Electronic package including electronic structure and electronic component Feng Kao 2024-04-30
11382214 Electronic package, assemble substrate, and method for fabricating the assemble substrate Wen-Liang Lien 2022-07-05
11152331 Electronic package and method for fabricating the same Feng Kao, Mao-Hua Yeh 2021-10-19
10236261 Electronic package and method for fabricating the same Fang-Lin Tsai, Yi-Feng Chang 2019-03-19
10163662 Fabrication method of semiconductor package Cheng-Chia Chiang, Don-Son Jiang, Shih-Hao Tung, Shu-Huei Huang 2018-12-25
9905546 Package on package structure and fabrication method thereof Shih-Hao Tung, Chang-Yi Lan, Cheng-Chia Chiang, Chu-Huei Huang 2018-02-27
9646921 Semiconductor package and fabrication method thereof Cheng-Chia Chiang, Don-Son Jiang, Shih-Hao Tung, Shu-Huei Huang 2017-05-09
9356008 Semiconductor package and fabrication method thereof Cheng-Chia Chiang, Hsin-Ta Lin, Fu-Tang Huang, Yu-Po Wang, Chu-Chi Hsu +1 more 2016-05-31
9343387 Package on package structure and fabrication method thereof Chu-Chi Hsu, Cheng-Chia Chiang, Chia-Kai Shih, Shu-Huei Huang 2016-05-17
9343421 Semiconductor package and fabrication method thereof Cheng-Chia Chiang, Chu-Chi Hsu, Chia-Kai Shih, Shu-Huei Huang 2016-05-17
5313715 Vernier calipers incorporated height gauge 1994-05-24