Lung-Yuan Wang — 16 Patents at Siliconware Precision Industries Co.

Lung-Yuan Wang has been granted 16 US patents while listed as an inventor at Siliconware Precision Industries Co.. The first was granted in 1994 and the most recent in July 2025. Lung-Yuan Wang ranks #284,196 of 4,157,543 US inventors in our database (top 6.8%). Patent records list Lung-Yuan Wang in Taichung, TW.

Patents per Year

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12368116	Electronic package and manufacturing method thereof	Feng Kao	2025-07-22
12283560	Electronic package including electronic structure and electronic body and manufacturing method thereof	Feng Kao	2025-04-22
12114427	Method for fabricating assemble substrate	Wen-Liang Lien	2024-10-08
12009340	Method for fabricating electronic package	Feng Kao, Mao-Hua Yeh	2024-06-11
11984393	Electronic package, manufacturing method for the same, and electronic structure	Feng Kao	2024-05-14
11973047	Electronic package including electronic structure and electronic component	Feng Kao	2024-04-30
11382214	Electronic package, assemble substrate, and method for fabricating the assemble substrate	Wen-Liang Lien	2022-07-05
11152331	Electronic package and method for fabricating the same	Feng Kao, Mao-Hua Yeh	2021-10-19
10236261	Electronic package and method for fabricating the same	Fang-Lin Tsai, Yi-Feng Chang	2019-03-19
10163662	Fabrication method of semiconductor package	Cheng-Chia Chiang, Don-Son Jiang, Shih-Hao Tung, Shu-Huei Huang	2018-12-25
9905546	Package on package structure and fabrication method thereof	Shih-Hao Tung, Chang-Yi Lan, Cheng-Chia Chiang, Chu-Huei Huang	2018-02-27	$201,000
9646921	Semiconductor package and fabrication method thereof	Cheng-Chia Chiang, Don-Son Jiang, Shih-Hao Tung, Shu-Huei Huang	2017-05-09	$1,508,000
9356008	Semiconductor package and fabrication method thereof	Cheng-Chia Chiang, Hsin-Ta Lin, Fu-Tang Huang, Yu-Po Wang, Chu-Chi Hsu +1 more	2016-05-31	$2,483,000
9343387	Package on package structure and fabrication method thereof	Chu-Chi Hsu, Cheng-Chia Chiang, Chia-Kai Shih, Shu-Huei Huang	2016-05-17	$1,025,000
9343421	Semiconductor package and fabrication method thereof	Cheng-Chia Chiang, Chu-Chi Hsu, Chia-Kai Shih, Shu-Huei Huang	2016-05-17	$1,025,000
5313715	Vernier calipers incorporated height gauge	—	1994-05-24