Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412819 | Electronic package and manufacturing method thereof | Yi-Min Fu, Chi-Ching Ho, Cheng-Yu Kang | 2025-09-09 |
| 12412820 | Electronic package and manufacturing method thereof | Yi-Min Fu, Chi-Ching Ho, Cheng-Yu Kang | 2025-09-09 |
| 12334452 | Electronic package and manufacturing method thereof | Chao Pu, Chi-Ching Ho, Yi-Min Fu, Fang-Lin Tsai | 2025-06-17 |
| 12199047 | Electronic package and manufacturing method thereof | Chao Pu, Chi-Ching Ho, Yi-Min Fu, Po-Yuan Su | 2025-01-14 |
| 12193221 | Semiconductor structure and method for forming the same | Wei-Che Chang, Kai Jen | 2025-01-07 |
| 12176291 | Electronic package and manufacturing method thereof | Chao Pu, Chi-Ching Ho, Yi-Min Fu, Shuai Liu | 2024-12-24 |
| 12051641 | Electronic package and manufacturing method thereof | Yi-Min Fu, Chi-Ching Ho, Cheng-Yu Kang | 2024-07-30 |
| 11631675 | Semiconductor memory structure and method for forming the same | Yi-Hao Chien, Hsiang-Po LIU | 2023-04-18 |
| 9356008 | Semiconductor package and fabrication method thereof | Cheng-Chia Chiang, Hsin-Ta Lin, Fu-Tang Huang, Lung-Yuan Wang, Chu-Chi Hsu +1 more | 2016-05-31 |
| 9269677 | Fabrication method of packaging substrate | Chia-Yin Chen, Yu-Ching Liu, Yueh-Chiung Chang | 2016-02-23 |
| 8901729 | Semiconductor package, packaging substrate and fabrication method thereof | Chia-Yin Chen, Yu-Ching Liu, Yueh-Chiung Chang | 2014-12-02 |
| 8304665 | Package substrate having landless conductive traces | Chiang-Cheng Chang, Yen-Ping Wang, Don-Son Jiang, Jeng-Yuan Lai | 2012-11-06 |
| 8207620 | Flip-chip semiconductor package and chip carrier for preventing corner delamination | Yuan-Lin Tzeng, Nai-Hao Kao, Jeng-Yuan Lai, Cheng-Hsu Hsiao | 2012-06-26 |
| 8183092 | Method of fabricating stacked semiconductor structure | Chien-Ping Huang, Chih-Ming Huang, Han-Ping Pu, Cheng-Hsu Hsiao | 2012-05-22 |
| 7939383 | Method for fabricating semiconductor package free of substrate | Chien-Ping Huang, Chih-Ming Huang | 2011-05-10 |
| 7816187 | Method for fabricating semiconductor package free of substrate | Chien-Ping Huang, Chih-Ming Huang | 2010-10-19 |
| 7808110 | Semiconductor package substrate | Chien-Ping Huang, Wei-Chun Lin, Wen-Cheng Lee | 2010-10-05 |
| 7772685 | Stacked semiconductor structure and fabrication method thereof | Chien-Ping Huang, Chih-Ming Huang, Han-Ping Pu, Cheng-Hsu Hsiao | 2010-08-10 |
| 7732913 | Semiconductor package substrate | Tsung-Tien Hsieh, Wen-Jung Chiang, Cheng-Hsu Hsiao, Sen-Yen Yang | 2010-06-08 |
| 7679178 | Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof | Han-Ping Pu, Chien-Ping Huang, Chih-Ming Huang, Cheng-Hsu Hsiao | 2010-03-16 |
| 7629199 | Method for fabricating semiconductor package with build-up layers formed on chip | Chien-Ping Huang | 2009-12-08 |
| 7564140 | Semiconductor package and substrate structure thereof | Wen-Hao Lee, Cheng-Hsu Hsiao | 2009-07-21 |
| 7423340 | Semiconductor package free of substrate and fabrication method thereof | Chien-Ping Huang, Chih-Ming Huang | 2008-09-09 |
| 7361846 | High electrical performance semiconductor package | Wen-Jung Chiang, Chien-Te Chen | 2008-04-22 |
| 7354796 | Method for fabricating semiconductor package free of substrate | Chien-Ping Huang, Chih-Ming Huang | 2008-04-08 |