Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476572 | Method for fabricating electronic package structure | Chih-Yuan Shih, Chih-Hsien Chiu, Tsung Li Lin, Chi-Pin Tsai, Chien-Cheng Lin +3 more | 2022-10-18 |
| 10587041 | Electronic package structure and fabrication method thereof | Chih-Yuan Shih, Chih-Hsien Chiu, Tsung Li Lin, Chi-Pin Tsai, Chien-Cheng Lin +3 more | 2020-03-10 |
| 10115712 | Electronic module | Shao-Chueh Hu, Don-Son Jiang | 2018-10-30 |
| 9269677 | Fabrication method of packaging substrate | Chia-Yin Chen, Yu-Ching Liu, Yu-Po Wang | 2016-02-23 |
| 8901729 | Semiconductor package, packaging substrate and fabrication method thereof | Chia-Yin Chen, Yu-Ching Liu, Yu-Po Wang | 2014-12-02 |
| 6414379 | Structure of disturbing plate having down set | Ya-Yi Lai, Chih-Tsung Hou, Kun-Ming Huang, Ching-Kun Yeh | 2002-07-02 |