Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476572 | Method for fabricating electronic package structure | Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung Li Lin, Chi-Pin Tsai, Chien-Cheng Lin +3 more | 2022-10-18 |
| 11437325 | Electronic device, electronic package and packaging substrate thereof | Ho-Chuan Lin, Hsiu-Fang Chien, Tsung Li Lin | 2022-09-06 |
| 10587041 | Electronic package structure and fabrication method thereof | Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung Li Lin, Chi-Pin Tsai, Chien-Cheng Lin +3 more | 2020-03-10 |
| 10096541 | Method for fabricating electronic package | Ching-Wen Chiang, Hsin-Chih Wang, Shih-Ching Chen | 2018-10-09 |
| 9754868 | Substrate structure, electronic package and method for fabricating the electronic package | Ching-Wen Chiang, Hsin-Chih Wang, Shih-Ching Chen | 2017-09-05 |
| 9058971 | Electro-optical module | Shih-Liang Peng, Jung-Pin Huang, Chin-Yu Ku, Hsien-Wen Chen | 2015-06-16 |