Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403596 | Method of fabricating packaging structure | Shih-Ching Chen, Chieh-Lung Lai | 2019-09-03 |
| 10249562 | Package structure and fabrication method thereof | Ching-Wen Chiang, Kuang-Hsin Chen | 2019-04-02 |
| 10199320 | Method of fabricating electronic package | Ching-Wen Chiang, Kuang-Hsin Chen, Sheng-Li Lu | 2019-02-05 |
| 10049973 | Electronic package and fabrication method thereof and substrate structure | Ching-Wen Chiang, Kuang-Hsin Chen | 2018-08-14 |
| 9875949 | Electronic package having circuit structure with plurality of metal layers, and fabrication method thereof | Hsiao-Chun Huang, Shih-Ching Chen, Guang-Hwa Ma | 2018-01-23 |
| 9818683 | Electronic package and method of fabricating the same | Ching-Wen Chiang, Kuang-Hsin Chen, Sheng-Li Lu | 2017-11-14 |
| 9748183 | Fabrication method of semiconductor package | Ching-Wen Chiang, Cheng-Hao Ciou, Cheng-Chieh Wu, Kuang-Hsin Chen | 2017-08-29 |
| 9627307 | Semiconductor package and fabrication method thereof | Ching-Wen Chiang, Cheng-Hao Ciou, Cheng-Chieh Wu, Kuang-Hsin Chen | 2017-04-18 |
| 9502335 | Package structure and method for fabricating the same | Chieh-Lung Lai, Hong-Da Chang, Mao-Hua Yeh | 2016-11-22 |
| 9196596 | Interposer and method of manufacturing the same | Ching-Wen Chiang, Kuang-Hsin Chen, Wei-Jen Chang | 2015-11-24 |
| 9058971 | Electro-optical module | Chih-Yuan Shih, Shih-Liang Peng, Jung-Pin Huang, Chin-Yu Ku | 2015-06-16 |
| 8970053 | Semiconductor package having light-emitting-diode solder-bonded on first and second conductive pads separated by at least 75 UM | Yuen-Han Wang, Sheng-Li Lu, Jih-Fu Wang, Kuan-Yu Yang | 2015-03-03 |
| 8486733 | Package having light-emitting element and fabrication method thereof | Jia-Shin Liou, Wen-Hao Lee | 2013-07-16 |