Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125828 | Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the same | Chi-Ching Ho, Bo MA, Yu-Ting Xue, Ching-Hung Tseng, Guan-Hua Lu | 2024-10-22 |
| 11923337 | Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the same | Chi-Ching Ho, Bo MA, Yu-Ting Xue, Ching-Hung Tseng, Guan-Hua Lu | 2024-03-05 |
| 11676877 | Electronic package with multiple electronic components spaced apart by grooves | Chun-Chang Ting, Chi-Jen Chen | 2023-06-13 |
| 11600571 | Electronic package, packaging substrate, and methods for fabricating the same | Jun Ding, Hsi-Chang Hsu | 2023-03-07 |
| 11398413 | Electronic package with multiple electronic components spaced apart by grooves | Chun-Chang Ting, Chi-Jen Chen | 2022-07-26 |
| 10903167 | Electronic package, packaging substrate, and methods for fabricating the same | Jun Ding, Hsi-Chang Hsu | 2021-01-26 |
| 9659806 | Semiconductor package having conductive pillars | Shih-Kuang Chiu | 2017-05-23 |
| 9607974 | Package structure and fabrication method thereof | Chun-Tang Lin, Shih-Ching Chen, Yi-Che Lai, Hung-Wen Liu, Yi-Wei Liu +1 more | 2017-03-28 |
| 9520304 | Semiconductor package and fabrication method thereof | Yi-Che Lai, Chi-Hsin Chiu, Shih-Kuang Chiu | 2016-12-13 |
| 9502335 | Package structure and method for fabricating the same | Chieh-Lung Lai, Hsien-Wen Chen, Mao-Hua Yeh | 2016-11-22 |
| 9487393 | Fabrication method of wafer level package having a pressure sensor | Hsin-Yi Liao, Chun-An Huang, Shih-Kuang Chiu, Chien-An Chen | 2016-11-08 |
| 9425119 | Package structure and fabrication method thereof | Shih-Kuang Chiu | 2016-08-23 |
| 9133021 | Wafer level package having a pressure sensor and fabrication method thereof | Hsin-Yi Liao, Chun-An Huang, Shih-Kuang Chiu, Chien-An Chen | 2015-09-15 |
| 8878356 | Package structure having micro-electro-mechanical system element and method of fabrication the same | Cheng-Hsiang Liu, Kuang-Wei Huang, Chun-Hung Lin, Hsin-Yi Liao | 2014-11-04 |
| 8633048 | Method for fabricating package structure having MEMS elements | CHEN-HAN LIN, Cheng-Hsiang Liu, Hsin-Yi Liao, Shih-Kuang Chiu | 2014-01-21 |
| 8525324 | Semiconductor package and method of fabricating the same | Hsin-Yi Liao | 2013-09-03 |
| 8399940 | Package structure having MEMS elements and fabrication method thereof | CHEN-HAN LIN, Hsin-Yi Liao, Shih-Kuang Chiu | 2013-03-19 |
| 8172632 | Method of making white LED package structure having a silicon substrate | Hung-Yi Lin | 2012-05-08 |
| 7821094 | Light emitting diode structure | Hung-Yi Lin | 2010-10-26 |
| 7741772 | White LED package structure having a silicon substrate and method of making the same | Hung-Yi Lin | 2010-06-22 |
| 7510892 | Light emitting diode structure and manufacturing method thereof | Hung-Yi Lin | 2009-03-31 |