Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8878356 | Package structure having micro-electro-mechanical system element and method of fabrication the same | Hong-Da Chang, Cheng-Hsiang Liu, Chun-Hung Lin, Hsin-Yi Liao | 2014-11-04 |