Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508739 | Method of manufacturing memory structure | Hui-Chin Huang, Kai-Yao Shih, Yu-Mei Liao | 2022-11-22 |
| 11195812 | Method for fabricating an encapsulated electronic package using a supporting plate | Cheng-Kai Chang, Bo MA, Chun-Chi Ke | 2021-12-07 |
| 11114412 | Electronic package and method for fabricating the same | Cheng-Kai Chang | 2021-09-07 |
| 9487393 | Fabrication method of wafer level package having a pressure sensor | Hong-Da Chang, Chun-An Huang, Shih-Kuang Chiu, Chien-An Chen | 2016-11-08 |
| 9254994 | Package structure having MEMS element | Chi-Hsin Chiu, Chih-Ming Huang, Chang-Yueh Chan, Chun-Chi Ke | 2016-02-09 |
| 9133021 | Wafer level package having a pressure sensor and fabrication method thereof | Hong-Da Chang, Chun-An Huang, Shih-Kuang Chiu, Chien-An Chen | 2015-09-15 |
| 9117698 | Fabrication method of semiconductor package | Yan-Heng Chen, Jung-Pang Huang, Shih-Kuang Chiu, Guang-Hwa Ma | 2015-08-25 |
| 9040361 | Chip scale package with electronic component received in encapsulant, and fabrication method thereof | Chiang-Cheng Chang, Chien-Ping Huang, Chun-Chi Ke, Hsi-Chang Hsu | 2015-05-26 |
| 8878356 | Package structure having micro-electro-mechanical system element and method of fabrication the same | Hong-Da Chang, Cheng-Hsiang Liu, Kuang-Wei Huang, Chun-Hung Lin | 2014-11-04 |
| 8866236 | Package structure having MEMS element | Chi-Hsin Chiu, Chih-Ming Huang, Chang-Yueh Chan, Chun-Chi Ke | 2014-10-21 |
| 8829672 | Semiconductor package, package structure and fabrication method thereof | Yan-Heng Chen, Jung-Pang Huang, Shih-Kuang Chiu, Guang-Hwa Ma | 2014-09-09 |
| 8766456 | Method of fabricating a semiconductor package | Hsi-Chang Hsu, Hsin-Hung Chou, Hung-Wen Liu, Chiang-Cheng Chang | 2014-07-01 |
| 8741693 | Method for manufacturing package structure with micro-electromechanical element | Chun-An Huang, Shih-Kuang Chiu | 2014-06-03 |
| 8716070 | Fabrication method of package structure having MEMS element | Chi-Hsin Chiu, Chih-Ming Huang, Chang-Yueh Chan, Chun-Chi Ke | 2014-05-06 |
| 8633048 | Method for fabricating package structure having MEMS elements | CHEN-HAN LIN, Hong-Da Chang, Cheng-Hsiang Liu, Shih-Kuang Chiu | 2014-01-21 |
| 8610272 | Package structure with micro-electromechanical element and manufacturing method thereof | Chun-An Huang, Shih-Kuang Chiu | 2013-12-17 |
| 8525324 | Semiconductor package and method of fabricating the same | Hong-Da Chang | 2013-09-03 |
| 8420430 | Fabrication method of package structure having MEMS element | Chi-Hsin Chiu, Chih-Ming Huang, Chang-Yueh Chan, Chun-Chi Ke | 2013-04-16 |
| 8399940 | Package structure having MEMS elements and fabrication method thereof | CHEN-HAN LIN, Hong-Da Chang, Shih-Kuang Chiu | 2013-03-19 |
| 8334174 | Chip scale package and fabrication method thereof | Chiang-Cheng Chang, Hsu-Hsi Chang, Shih-Kuang Chiu | 2012-12-18 |
| 8288189 | Package structure having MEMS element and fabrication method thereof | Chun-An Huang, Shih-Kuang Chiu | 2012-10-16 |