Issued Patents All Time
Showing 1–25 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289409 | Method for fabricating carrier-free semiconductor package | Yueh-Ying Tsai, Fu Tang, Chien-Ping Huang | 2022-03-29 |
| 11195812 | Method for fabricating an encapsulated electronic package using a supporting plate | Hsin-Yi Liao, Cheng-Kai Chang, Bo MA | 2021-12-07 |
| 10833394 | Electronic package and method for fabricating the same | Wen-Jung Tsai, Mao-Hua Yeh, Chih-Hsien Chiu, Ying-Chou Tsai | 2020-11-10 |
| 10566271 | Carrier-free semiconductor package and fabrication method | Yueh-Ying Tsai, Fu Tang, Chien-Ping Huang | 2020-02-18 |
| 10192834 | Semiconductor package and fabrication method thereof | Fu-Tang Huang | 2019-01-29 |
| 10074613 | Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages | Chih-Hsien Chiu, Hao-Ju Fang, Hsin-Lung Chung, Cho-Hsin Chang, Tsung-Hsien Tsai +1 more | 2018-09-11 |
| 9673151 | Semiconductor package having metal layer | Chih-Hsien Chiu, Hao-Ju Fang, Hsin-Lung Chung, Cho-Hsin Chang, Tsung-Hsien Tsai +1 more | 2017-06-06 |
| 9425152 | Method for fabricating EMI shielding package structure | Chin-Tsai Yao, Chien-Ping Huang | 2016-08-23 |
| 9254994 | Package structure having MEMS element | Chi-Hsin Chiu, Chih-Ming Huang, Chang-Yueh Chan, Hsin-Yi Liao | 2016-02-09 |
| 9190387 | Method for fabricating quad flat non-leaded package structure with electromagnetic interference shielding function | Chin-Tsai Yao, Chien-Ping Huang | 2015-11-17 |
| 9190296 | Fabrication method of semiconductor package without chip carrier | Yueh-Ying Tsai, Fu Tang, Chien-Ping Huang | 2015-11-17 |
| 9177837 | Fabrication method of semiconductor package having electrical connecting structures | Pang-Chun Lin, Chun-Yuan Li, Fu Tang, Chien-Ping Huang | 2015-11-03 |
| 9040361 | Chip scale package with electronic component received in encapsulant, and fabrication method thereof | Chiang-Cheng Chang, Chien-Ping Huang, Hsin-Yi Liao, Hsi-Chang Hsu | 2015-05-26 |
| 8981575 | Semiconductor package structure | Pang-Chun Lin, Chun-Yuan Li, Chien-Ping Huang | 2015-03-17 |
| 8975734 | Semiconductor package without chip carrier and fabrication method thereof | Yueh-Ying Tsai, Fu Tang, Chien-Ping Huang | 2015-03-10 |
| 8963298 | EMI shielding package structure and method for fabricating the same | Chin-Tsai Yao, Chien-Ping Huang | 2015-02-24 |
| 8873244 | Package structure | Pang-Chun Lin, Hsiao-Jen Hung, Chun-Yuan Li, Chien-Ping Huang | 2014-10-28 |
| 8866236 | Package structure having MEMS element | Chi-Hsin Chiu, Chih-Ming Huang, Chang-Yueh Chan, Hsin-Yi Liao | 2014-10-21 |
| 8736030 | Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same | Chin-Tsai Yao, Chien-Ping Huang | 2014-05-27 |
| 8716070 | Fabrication method of package structure having MEMS element | Chi-Hsin Chiu, Chih-Ming Huang, Chang-Yueh Chan, Hsin-Yi Liao | 2014-05-06 |
| 8716861 | Semiconductor package having electrical connecting structures and fabrication method thereof | Pang-Chun Lin, Chun-Yuan Li, Fu Tang, Chien-Ping Huang | 2014-05-06 |
| 8653661 | Package having MEMS element and fabrication method thereof | Chang-Yueh Chan, Chien-Ping Huang, Shih-Kuang Chiu | 2014-02-18 |
| 8564115 | Package structure having micro-electromechanical element | Chang-Yueh Chan, Chien-Ping Huang, Chun-An Huang, Chih-Ming Huang | 2013-10-22 |
| 8525348 | Chip scale package and fabrication method thereof | Chiang-Cheng Chang, Chien-Ping Huang | 2013-09-03 |
| 8420430 | Fabrication method of package structure having MEMS element | Chi-Hsin Chiu, Chih-Ming Huang, Chang-Yueh Chan, Hsin-Yi Liao | 2013-04-16 |