Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527472 | Electronic package, supporting structure and fabrication method thereof | Hao-Ju Fang, Ting-Wei Chi, Te-Fang Chu | 2022-12-13 |
| 10074613 | Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages | Chih-Hsien Chiu, Hao-Ju Fang, Hsin-Lung Chung, Tsung-Hsien Tsai, Chia-Yang Chen +1 more | 2018-09-11 |
| 9899335 | Method for fabricating package structure | Chih-Hsien Chiu, Hsin-Lung Chung, Chia-Yang Chen, Chao-Ya Yang | 2018-02-20 |
| 9673151 | Semiconductor package having metal layer | Chih-Hsien Chiu, Hao-Ju Fang, Hsin-Lung Chung, Tsung-Hsien Tsai, Chia-Yang Chen +1 more | 2017-06-06 |
| 9508656 | Package structure and method for fabricating the same | Chih-Hsien Chiu, Hsin-Lung Chung, Chia-Yang Chen, Chao-Ya Yang | 2016-11-29 |
| 9490219 | Semiconductor package with shielding member and method of manufacturing the same | Tsung-Hsien Hsu, Hsin-Lung Chung, Te-Fang Chu, Chia-Yang Chen | 2016-11-08 |
| 7655540 | Method and jig structure for positioning bare dice | — | 2010-02-02 |