Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942272 | Aramid fiber electrochemical capacitor and preparation method therefor | Aijuan Gu, Guozheng Liang, Li Yuan | 2024-03-26 |
| 11527472 | Electronic package, supporting structure and fabrication method thereof | Cho-Hsin Chang, Ting-Wei Chi, Te-Fang Chu | 2022-12-13 |
| 11387053 | Aramid fiber electrode and preparation method therefor | Aijuan Gu, Guozheng Liang, Li Yuan | 2022-07-12 |
| 10074613 | Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages | Chih-Hsien Chiu, Hsin-Lung Chung, Cho-Hsin Chang, Tsung-Hsien Tsai, Chia-Yang Chen +1 more | 2018-09-11 |
| 9673151 | Semiconductor package having metal layer | Chih-Hsien Chiu, Hsin-Lung Chung, Cho-Hsin Chang, Tsung-Hsien Tsai, Chia-Yang Chen +1 more | 2017-06-06 |
| 9526171 | Package structure and fabrication method thereof | Chi-Liang Shih, Hsin-Lung Chung, Te-Fang Chu, Kuang-Neng Chung | 2016-12-20 |
| 9520400 | NOR structure flash memory and manufacturing method thereof | Shizhen Sun, Yong Gu | 2016-12-13 |
| 9502758 | Electronic package and fabrication method thereof | Hsin-Lung Chung, Chih-Hsien Chiu, Yude Chu, Tsung-Hsien Tsai | 2016-11-22 |
| 8766416 | Semiconductor package and fabrication method thereof | Tsung-Hsien Hsu, Hsin-Lung Chung | 2014-07-01 |