Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10566320 | Method for fabricating electronic package | Chi-Liang Shih, Chun-Chong Chien, Te-Fang Chu | 2020-02-18 |
| 10074613 | Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages | Chih-Hsien Chiu, Hao-Ju Fang, Cho-Hsin Chang, Tsung-Hsien Tsai, Chia-Yang Chen +1 more | 2018-09-11 |
| 10062582 | Fabrication method of package having ESD and EMI preventing functions | Tsung-Hsien Tsai, Chih-Hsien Chiu, Chien-Cheng Lin | 2018-08-28 |
| 9997477 | Method of manufacturing semiconductor package | Tsung-Hsien Tsai, Heng-Cheng Chu, Chien-Cheng Lin, Chih-Hsien Chiu, Yude Chu | 2018-06-12 |
| 9907186 | Electronic package structure and method for fabricating the same | Chih-Hsien Chiu, Chen-Wen Huang, Wen-Jung Tsai, Jia-Huei Hung, Fu-Tang Huang | 2018-02-27 |
| 9899335 | Method for fabricating package structure | Chih-Hsien Chiu, Cho-Hsin Chang, Chia-Yang Chen, Chao-Ya Yang | 2018-02-20 |
| 9673151 | Semiconductor package having metal layer | Chih-Hsien Chiu, Hao-Ju Fang, Cho-Hsin Chang, Tsung-Hsien Tsai, Chia-Yang Chen +1 more | 2017-06-06 |
| 9526171 | Package structure and fabrication method thereof | Chi-Liang Shih, Te-Fang Chu, Hao-Ju Fang, Kuang-Neng Chung | 2016-12-20 |
| 9508656 | Package structure and method for fabricating the same | Chih-Hsien Chiu, Cho-Hsin Chang, Chia-Yang Chen, Chao-Ya Yang | 2016-11-29 |
| 9502758 | Electronic package and fabrication method thereof | Hao-Ju Fang, Chih-Hsien Chiu, Yude Chu, Tsung-Hsien Tsai | 2016-11-22 |
| 9490219 | Semiconductor package with shielding member and method of manufacturing the same | Cho-Hsin Chang, Tsung-Hsien Hsu, Te-Fang Chu, Chia-Yang Chen | 2016-11-08 |
| 9343401 | Semiconductor package and fabrication method thereof | Chi-Liang Shih, Te-Fang Chu, Sheng-Ming Yang, Hung-Cheng Chen, Chia-Yang Chen | 2016-05-17 |
| 9337250 | Semiconductor package and method of manufacturing the same | Tsung-Hsien Tsai, Heng-Cheng Chu, Chien-Cheng Lin, Chih-Hsien Chiu, Yude Chu | 2016-05-10 |
| 9257394 | Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor package | Kuang-Neng Chung, Tien-Chung Huang, Tsung-Hsien Hsu | 2016-02-09 |
| 9111945 | Package having ESD and EMI preventing functions and fabrication method thereof | Tsung-Hsien Tsai, Chih-Hsien Chiu, Chien-Cheng Lin | 2015-08-18 |
| 8962396 | Fabrication method of carrier-free semiconductor package | Ching-Hua Chen, Heng-Cheng Chu, Chih-Hsien Chiu, Chia-Yang Chen | 2015-02-24 |
| 8766416 | Semiconductor package and fabrication method thereof | Tsung-Hsien Hsu, Hao-Ju Fang | 2014-07-01 |
| 8618655 | Carrier-free semiconductor package | Ching-Hua Chen, Heng-Cheng Chu, Chih-Hsien Chiu, Chia-Yang Chen | 2013-12-31 |
| 8264070 | Package structure with ESD and EMI preventing functions | Tsung-Hsien Tsai, Heng-Cheng Chu, Chao-Ya Yang | 2012-09-11 |