Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476572 | Method for fabricating electronic package structure | Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung Li Lin, Chi-Pin Tsai +3 more | 2022-10-18 |
| 10587037 | Electronic package structure | Chih-Hsien Chiu, Chien-Cheng Lin, Tsung-Hsien Tsai, Chao-Ya Yang, Yude Chu | 2020-03-10 |
| 10587041 | Electronic package structure and fabrication method thereof | Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung Li Lin, Chi-Pin Tsai +3 more | 2020-03-10 |
| 10230152 | Electronic package and fabrication method thereof | Chih-Hsien Chiu, Chien-Cheng Lin, Tsung-Hsien Tsai, Chao-Ya Yang | 2019-03-12 |
| 10199731 | Electronic component | Chih-Hsien Chiu, Cheng-Yu Chiang | 2019-02-05 |
| 9997477 | Method of manufacturing semiconductor package | Tsung-Hsien Tsai, Chien-Cheng Lin, Chih-Hsien Chiu, Hsin-Lung Chung, Yude Chu | 2018-06-12 |
| 9627748 | Electronic component | Chih-Hsien Chiu, Cheng-Yu Chiang | 2017-04-18 |
| 9337250 | Semiconductor package and method of manufacturing the same | Tsung-Hsien Tsai, Chien-Cheng Lin, Chih-Hsien Chiu, Hsin-Lung Chung, Yude Chu | 2016-05-10 |
| 8962396 | Fabrication method of carrier-free semiconductor package | Ching-Hua Chen, Hsin-Lung Chung, Chih-Hsien Chiu, Chia-Yang Chen | 2015-02-24 |
| 8963299 | Semiconductor package and fabrication method thereof | Chien-Cheng Lin, Tsung-Hsien Hsu, Chao-Ya Yang, Chih-Ming Cheng | 2015-02-24 |
| 8618655 | Carrier-free semiconductor package | Ching-Hua Chen, Hsin-Lung Chung, Chih-Hsien Chiu, Chia-Yang Chen | 2013-12-31 |
| 8264070 | Package structure with ESD and EMI preventing functions | Tsung-Hsien Tsai, Hsin-Lung Chung, Chao-Ya Yang | 2012-09-11 |