Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211776 | Electronic package and manufacturing method thereof | Chih-Hsien Chiu, Ko-Wei Chang, Wen-Jung Tsai, Che-Wei Yu | 2025-01-28 |
| 12100641 | Electronic package and method for manufacturing the same | Chih-Hsien Chiu, Siang-Yu Lin, Wen-Jung Tsai, Chien-Cheng Lin | 2024-09-24 |
| 12057409 | Electronic package and manufacturing method thereof | Chih-Hsien Chiu, Wen-Jung Tsai, Chien-Cheng Lin, Ko-Wei Chang, Yu-Wei Yeh +1 more | 2024-08-06 |
| 11764162 | Electronic package and method for manufacturing the same | Ming-Fan Tsai, Chih-Wei Chen, Tsung-Hsien Tsai, Chao-Ya Yang | 2023-09-19 |
| 11749583 | Electronic package and method for manufacturing the same | Chih-Hsien Chiu, Siang-Yu Lin, Wen-Jung Tsai, Chien-Cheng Lin | 2023-09-05 |
| 11723144 | Electronic device and circuit board thereof | Ming-Fan Tsai, Chih-Wei Chen, Chien-Cheng Lin, Chao-Ya Yang | 2023-08-08 |
| 11222852 | Method for fabricating electronic package | Chih-Hsien Chiu | 2022-01-11 |
| 11069633 | Electronic package | Ming-Fan Tsai, Chih-Hsien Chiu, Tsung-Hsien Tsai, Chao-Ya Yang | 2021-07-20 |
| 10916526 | Method for fabricating electronic package with conductive pillars | Chih-Hsien Chiu, Chih-Chiang He | 2021-02-09 |
| 10643974 | Electronic package with conductive pillars | Chih-Hsien Chiu, Chih-Chiang He | 2020-05-05 |
| 10461041 | Electronic package and method for fabricating the same | Chih-Hsien Chiu | 2019-10-29 |
| 10410970 | Electronic package and method for fabricating the same | Chih-Hsien Chiu | 2019-09-10 |
| 10199317 | Electronic package | Chih-Hsien Chiu, Ying-Wei Lu, Jyun-Yuan Jhang, Ming-Fan Tsai | 2019-02-05 |
| 10074613 | Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages | Chih-Hsien Chiu, Hao-Ju Fang, Hsin-Lung Chung, Cho-Hsin Chang, Tsung-Hsien Tsai +1 more | 2018-09-11 |
| 10074621 | Electronic package with antenna structure | Chih-Hsien Chiu, Chi-Pin Tsai, Chi-Liang Shih, Ming-Fan Tsai | 2018-09-11 |
| 9999132 | Electronic package | Chih-Hsien Chiu, Ying-Wei Lu, Jyun-Yuan Jhang, Ming-Fan Tsai | 2018-06-12 |
| 9899335 | Method for fabricating package structure | Chih-Hsien Chiu, Hsin-Lung Chung, Cho-Hsin Chang, Chao-Ya Yang | 2018-02-20 |
| 9673151 | Semiconductor package having metal layer | Chih-Hsien Chiu, Hao-Ju Fang, Hsin-Lung Chung, Cho-Hsin Chang, Tsung-Hsien Tsai +1 more | 2017-06-06 |
| 9508656 | Package structure and method for fabricating the same | Chih-Hsien Chiu, Hsin-Lung Chung, Cho-Hsin Chang, Chao-Ya Yang | 2016-11-29 |
| 9502377 | Semiconductor package and fabrication method thereof | Chih-Hsien Chiu, Tsung-Hsien Tsai, Chao-Ya Yang, Chih-Ming Cheng, Yude Chu | 2016-11-22 |
| 9490219 | Semiconductor package with shielding member and method of manufacturing the same | Cho-Hsin Chang, Tsung-Hsien Hsu, Hsin-Lung Chung, Te-Fang Chu | 2016-11-08 |
| 9343401 | Semiconductor package and fabrication method thereof | Chi-Liang Shih, Hsin-Lung Chung, Te-Fang Chu, Sheng-Ming Yang, Hung-Cheng Chen | 2016-05-17 |
| 8962396 | Fabrication method of carrier-free semiconductor package | Ching-Hua Chen, Heng-Cheng Chu, Hsin-Lung Chung, Chih-Hsien Chiu | 2015-02-24 |
| 8725409 | Vehicle navigation system and navigation method thereof | — | 2014-05-13 |
| 8618655 | Carrier-free semiconductor package | Ching-Hua Chen, Heng-Cheng Chu, Hsin-Lung Chung, Chih-Hsien Chiu | 2013-12-31 |