Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10916526 | Method for fabricating electronic package with conductive pillars | Chih-Hsien Chiu, Chia-Yang Chen | 2021-02-09 |
| 10643974 | Electronic package with conductive pillars | Chih-Hsien Chiu, Chia-Yang Chen | 2020-05-05 |