Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764162 | Electronic package and method for manufacturing the same | Ming-Fan Tsai, Chih-Wei Chen, Tsung-Hsien Tsai, Chia-Yang Chen | 2023-09-19 |
| 11723144 | Electronic device and circuit board thereof | Ming-Fan Tsai, Chih-Wei Chen, Chien-Cheng Lin, Chia-Yang Chen | 2023-08-08 |
| 11069633 | Electronic package | Ming-Fan Tsai, Chih-Hsien Chiu, Tsung-Hsien Tsai, Chia-Yang Chen | 2021-07-20 |
| 10587037 | Electronic package structure | Chih-Hsien Chiu, Heng-Cheng Chu, Chien-Cheng Lin, Tsung-Hsien Tsai, Yude Chu | 2020-03-10 |
| 10230152 | Electronic package and fabrication method thereof | Chih-Hsien Chiu, Heng-Cheng Chu, Chien-Cheng Lin, Tsung-Hsien Tsai | 2019-03-12 |
| 9899335 | Method for fabricating package structure | Chih-Hsien Chiu, Hsin-Lung Chung, Cho-Hsin Chang, Chia-Yang Chen | 2018-02-20 |
| 9508656 | Package structure and method for fabricating the same | Chih-Hsien Chiu, Hsin-Lung Chung, Cho-Hsin Chang, Chia-Yang Chen | 2016-11-29 |
| 9502377 | Semiconductor package and fabrication method thereof | Chih-Hsien Chiu, Tsung-Hsien Tsai, Chia-Yang Chen, Chih-Ming Cheng, Yude Chu | 2016-11-22 |
| 8963299 | Semiconductor package and fabrication method thereof | Chien-Cheng Lin, Tsung-Hsien Hsu, Heng-Cheng Chu, Chih-Ming Cheng | 2015-02-24 |
| 8912959 | Packaging structure and method of fabricating the same | Chih-Hsien Chiu, Tsung-Hsien Tsai | 2014-12-16 |
| 8264070 | Package structure with ESD and EMI preventing functions | Tsung-Hsien Tsai, Heng-Cheng Chu, Hsin-Lung Chung | 2012-09-11 |