Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973014 | Method of manufacturing substrate structure with filling material formed in concave portion | Chang-Fu Lin, Chin-Tsai Yao, Chun-Tang Lin | 2024-04-30 |
| 11516925 | Package stack structure and method for manufacturing the same | Han-Hung Chen, Yuan-Hung Hsu, Chang-Fu Lin, Rung-Jeng Lin | 2022-11-29 |
| 11205644 | Method for fabricating electronic package | Chi-Rui Wu, Chia-Cheng Chen, Chun-Hsien Lin, Hsuan-Hao Mi, Yu-Cheng Pai | 2021-12-21 |
| 10872870 | Fabrication method of semiconductor structure | Yi-Cheih Chen, Sung-Huan Sun, Cheng-An Chang, Chien-Hung Wu | 2020-12-22 |
| 10629572 | Electronic package and method for fabricating the same | Chi-Rui Wu, Chia-Cheng Chen, Chun-Hsien Lin, Hsuan-Hao Mi, Yu-Cheng Pai | 2020-04-21 |
| 10522453 | Substrate structure with filling material formed in concave portion | Chang-Fu Lin, Chin-Tsai Yao, Chun-Tang Lin | 2019-12-31 |
| 10510720 | Electronic package and method for fabricating the same | Chang-Fu Lin, Chin-Tsai Yao, Kuo-Hua Yu | 2019-12-17 |
| 10361150 | Substrate construction and electronic package including the same | Chee-Key Chung, Yu-Min Lo, Han-Hung Chen, Chang-Fu Lin | 2019-07-23 |
| 10325872 | Fabrication method of semiconductor structure | Yi-Cheih Chen, Sung-Huan Sun, Cheng-An Chang, Chien-Hung Wu | 2019-06-18 |
| 10199331 | Fabrication method of electronic package having embedded package block | Meng-Tsung Lee | 2019-02-05 |
| 10192834 | Semiconductor package and fabrication method thereof | Chun-Chi Ke | 2019-01-29 |
| 9907186 | Electronic package structure and method for fabricating the same | Chih-Hsien Chiu, Chen-Wen Huang, Hsin-Lung Chung, Wen-Jung Tsai, Jia-Huei Hung | 2018-02-27 |
| 9900996 | Package substrate and structure | Chang-Fu Lin, Chin-Tsai Yao, Ming-Chin Chuang, Ko-Cheng Liu | 2018-02-20 |
| 9842771 | Semiconductor device and fabrication method thereof and semiconductor structure | Chang-Fu Lin, Chin-Tsai Yao, Hung-Ming Chang, Ming-Chin Chuang | 2017-12-12 |
| 9812340 | Method of fabricating semiconductor package having semiconductor element | Chiang-Cheng Chang, Meng-Tsung Lee, Jung-Pang Huang, Shih-Kuang Chiu | 2017-11-07 |
| 9735124 | Semiconductor structure and method of fabricating the same | Yi-Cheih Chen, Sung-Huan Sun, Cheng-An Chang, Chien-Hung Wu | 2017-08-15 |
| 9607963 | Semiconductor device and fabrication method thereof | Chang-Fu Lin, Chin-Tsai Yao, Ming-Chin Chuang | 2017-03-28 |
| 9524944 | Method for fabricating package structure | Chun-Wei Yeh, Chun-Hsien Shen, Hsiu-Jung Li, Ya-Yi Lai | 2016-12-20 |
| 9520351 | Packaging substrate and package structure | Chang-Fu Lin, Chin-Tsai Yao, Ming-Chin Chuang, Ko-Cheng Liu | 2016-12-13 |
| 9362245 | Package structure and fabrication method thereof | Chun-Wei Yeh, Chun-Hsien Shen, Hsiu-Jung Li, Ya-Yi Lai | 2016-06-07 |
| 9356008 | Semiconductor package and fabrication method thereof | Cheng-Chia Chiang, Hsin-Ta Lin, Yu-Po Wang, Lung-Yuan Wang, Chu-Chi Hsu +1 more | 2016-05-31 |
| 9324585 | Semiconductor package and method of fabricating the same | Chiang-Cheng Chang, Meng-Tsung Lee, Jung-Pang Huang, Shih-Kuang Chiu | 2016-04-26 |
| 8162672 | High power receptacle connector | — | 2012-04-24 |