Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524944 | Method for fabricating package structure | Chun-Wei Yeh, Chun-Hsien Shen, Ya-Yi Lai, Fu-Tang Huang | 2016-12-20 |
| 9362245 | Package structure and fabrication method thereof | Chun-Wei Yeh, Chun-Hsien Shen, Ya-Yi Lai, Fu-Tang Huang | 2016-06-07 |