Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524944 | Method for fabricating package structure | Chun-Wei Yeh, Chun-Hsien Shen, Hsiu-Jung Li, Fu-Tang Huang | 2016-12-20 |
| 9362245 | Package structure and fabrication method thereof | Chun-Wei Yeh, Chun-Hsien Shen, Hsiu-Jung Li, Fu-Tang Huang | 2016-06-07 |
| 7019389 | Lead frame and semiconductor package with the same | Jeng-Yuan Lai, Yuan-Lin Tzeng | 2006-03-28 |
| 6642735 | Semiconductor package for chip with testing contact pad connected to outside | Lien-Chen Chiang | 2003-11-04 |
| 6414379 | Structure of disturbing plate having down set | Yueh-Chiung Chang, Chih-Tsung Hou, Kun-Ming Huang, Ching-Kun Yeh | 2002-07-02 |