Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8207620 | Flip-chip semiconductor package and chip carrier for preventing corner delamination | Nai-Hao Kao, Jeng-Yuan Lai, Yu-Po Wang, Cheng-Hsu Hsiao | 2012-06-26 |
| 7019389 | Lead frame and semiconductor package with the same | Jeng-Yuan Lai, Ya-Yi Lai | 2006-03-28 |