Issued Patents All Time
Showing 1–25 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10242972 | Package structure and fabrication method thereof | Lu-Yi Chen, Chang-Lun Lu, Shih-Ching Chen, Guang-Hwa Ma | 2019-03-26 |
| 8895366 | Fabrication method of semiconductor package | Wen-Home Huang, Wen-Tsung Tseng, Chang-Fu Lin, Ho-Yi Tsai | 2014-11-25 |
| 8698326 | Semiconductor package and fabrication method thereof | Wen-Home Huang, Wen-Tsung Tseng, Chang-Fu Lin, Ho-Yi Tsai | 2014-04-15 |
| 8420521 | Method for fabricating stack structure of semiconductor packages | Fang-Lin Tsai, Ho-Yi Tsai, Han-Ping Pu | 2013-04-16 |
| 8361843 | Method for fabricating heat dissipation package structure | Min-Shun Hung, Ho-Yi Tsai, Chien-Ping Huang | 2013-01-29 |
| 8207620 | Flip-chip semiconductor package and chip carrier for preventing corner delamination | Yuan-Lin Tzeng, Nai-Hao Kao, Jeng-Yuan Lai, Yu-Po Wang | 2012-06-26 |
| 8183092 | Method of fabricating stacked semiconductor structure | Chien-Ping Huang, Chih-Ming Huang, Han-Ping Pu, Yu-Po Wang | 2012-05-22 |
| 8062933 | Method for fabricating heat dissipating package structure | Chien-Ping Huang | 2011-11-22 |
| 8058100 | Method for fabricating chip scale package structure with metal pads exposed from an encapsulant | Han-Ping Pu, Chien-Ping Huang | 2011-11-15 |
| 8013436 | Heat dissipation package structure and method for fabricating the same | Min-Shun Hung, Yo-Yi Tsai, Chien-Ping Huang | 2011-09-06 |
| 8008769 | Heat-dissipating semiconductor package structure and method for manufacturing the same | Wen-Tsung Tseng, Ho-Yi Tsai, Chien-Ping Huang | 2011-08-30 |
| 7993967 | Semiconductor package fabrication method | Yih-Jenn Jiang, Han-Ping Pu, Chien-Ping Huang | 2011-08-09 |
| 7981729 | Fabrication method of multi-chip stack structure | Jung-Pin Huang, Chin-Huang Chang, Chien-Ping Huang, Chung-Lun Liu | 2011-07-19 |
| 7855443 | Stack structure of semiconductor packages and method for fabricating the stack structure | Fang-Lin Tsai, Ho-Yi Tsai, Han-Ping Pu | 2010-12-21 |
| 7772685 | Stacked semiconductor structure and fabrication method thereof | Chien-Ping Huang, Chih-Ming Huang, Han-Ping Pu, Yu-Po Wang | 2010-08-10 |
| 7768106 | Multi-chip stack structure and fabrication method thereof | Jung-Ping Huang, Chin-Huang Chang, Chien-Ping Huang, Chung-Lun Liu | 2010-08-03 |
| 7759170 | Fabrication method of semiconductor package having heat dissipation device | Han-Ping Pu, Chien-Ping Huang | 2010-07-20 |
| 7750467 | Chip scale package structure with metal pads exposed from an encapsulant | Han-Ping Pu, Chien-Ping Huang | 2010-07-06 |
| 7745262 | Heat dissipating package structure and method for fabricating the same | Chien-Ping Huang | 2010-06-29 |
| 7732913 | Semiconductor package substrate | Tsung-Tien Hsieh, Wen-Jung Chiang, Yu-Po Wang, Sen-Yen Yang | 2010-06-08 |
| 7713846 | Process applied to semiconductor | Ru-Sheng Liu, Han-Lung Tsai | 2010-05-11 |
| 7679178 | Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof | Han-Ping Pu, Chien-Ping Huang, Chih-Ming Huang, Yu-Po Wang | 2010-03-16 |
| 7671466 | Semiconductor package having heat dissipating device with cooling fluid | Han-Ping Pu, Chien-Ping Huang | 2010-03-02 |
| 7666716 | Fabrication method of semiconductor package | Han-Ping Pu | 2010-02-23 |
| 7638879 | Semiconductor package and fabrication method thereof | Yih-Jenn Jiang, Han-Ping Pu, Chien-Ping Huang | 2009-12-29 |