Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676983 | Sensor with dam structure and method for manufacturing the same | Chung-Chang Chang, Ming-Hung Lin | 2023-06-13 |
| D983819 | Display screen or portion thereof with graphical user interface | Hongli Chen | 2023-04-18 |
| 10796970 | Method for fabricating electronic package | Lu-Yi Chen | 2020-10-06 |
| 10461002 | Fabrication method of electronic module | Lu-Yi Chen, Shih-Ching Chen | 2019-10-29 |
| 10403570 | Method for fabricating electronic package | Lu-Yi Chen, Hung-Yuan Li, Chieh-Lung Lai, Shih-Liang Peng | 2019-09-03 |
| 10242972 | Package structure and fabrication method thereof | Lu-Yi Chen, Shih-Ching Chen, Guang-Hwa Ma, Cheng-Hsu Hsiao | 2019-03-26 |
| 10211082 | Fabrication method of electronic package | Lu-Yi Chen | 2019-02-19 |
| 10201086 | Electronic device | Lu-Yi Chen, Cheng-Hsiang Liu, Jun Liao, Cheng-Yi Chen | 2019-02-05 |
| 10141233 | Electronic package and fabrication method thereof | Lu-Yi Chen | 2018-11-27 |
| 10128178 | Electronic package and method for fabricating the same | Lu-Yi Chen, Hung-Yuan Li, Chieh-Lung Lai, Shih-Liang Peng | 2018-11-13 |
| 9899309 | Electronic package and semiconductor substrate | Shih-Ching Chen, Shih-Liang Peng, Chieh-Lung Lai, Jia-Wei Pan | 2018-02-20 |
| 9831191 | Electronic package, semiconductor substrate of the electronic package, and method for manufacturing the electronic package | Chieh-Lung Lai, Mao-Hua Yeh, Hung-Yuan Li, Shih-Liang Peng | 2017-11-28 |
| 9818635 | Carrier structure, packaging substrate, electronic package and fabrication method thereof | Lu-Yi Chen | 2017-11-14 |
| 9735075 | Electronic module and fabrication method thereof | Lu-Yi Chen, Shih-Ching Chen | 2017-08-15 |
| 9601403 | Electronic package and fabrication method thereof | Lu-Yi Chen, Guang-Hwa Ma, Shih-Ching Chen | 2017-03-21 |
| 9515039 | Substrate structure with first and second conductive bumps having different widths | Chieh-Lung Lai, Lu-Yi Chen, Yu-Chuan Chen | 2016-12-06 |
| 9263380 | Semiconductor interposer and package structure having the same | Jyun-Ling Tsai | 2016-02-16 |