Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11852679 | Circuit board for semiconductor test | Jun-Liang Lai, Shung-Bo Lin, Ta-Cheng Liao, Yu-Chih Hsiao, Kun-Han Hsieh | 2023-12-26 |
| 11612744 | Head cap with channel identification | Chih-Wei Peng, Che-Wei Lin, Jia-Jin Chen, Chun-Wei Wu, Samuel T. Wang +2 more | 2023-03-28 |
| 11513638 | Silver nanowire protection layer structure and manufacturing method thereof | Yeh-Sheng Wang, Wei-Chia Fang, Chun-Hung Chu, Chung-Chin Hsiao, Ya-Ting Lin | 2022-11-29 |
| 11353996 | Touch-sensing cover and manufacturing method thereof | Shun-Jie Yang, Chen Cheng | 2022-06-07 |
| 11249572 | Touch panel | Wei-Chia Fang, Chun-Hung Chu, Chung-Chin Hsiao | 2022-02-15 |
| 11050207 | Crimping apparatus and system for crimping a flexible printed circuit | Tung-Sheng Chen, Chih-Cheng Chuang | 2021-06-29 |
| 10543367 | Transcranial burst electrostimulation apparatus and its applications | Chih-Wei Peng, Yu-Ting Li, HSIANG-CHING LEE, Jia-Jin Chen, Tsung-Hsun Hsieh +2 more | 2020-01-28 |
| 10461002 | Fabrication method of electronic module | Lu-Yi Chen, Chang-Lun Lu | 2019-10-29 |
| 10434707 | Touch substrate manufactured by three-dimensional printing and method for manufacturing the same | Shun-Jie Yang, Shun-Ta Chien, Wen-Fu Huang | 2019-10-08 |
| 10403596 | Method of fabricating packaging structure | Hsien-Wen Chen, Chieh-Lung Lai | 2019-09-03 |
| 10242972 | Package structure and fabrication method thereof | Lu-Yi Chen, Chang-Lun Lu, Guang-Hwa Ma, Cheng-Hsu Hsiao | 2019-03-26 |
| 10096541 | Method for fabricating electronic package | Ching-Wen Chiang, Hsin-Chih Wang, Chih-Yuan Shih | 2018-10-09 |
| 10014641 | Crimping apparatus and system for crimping a flexible printed circuit | Tung-Sheng Chen, Chih-Cheng Chuang | 2018-07-03 |
| 9899309 | Electronic package and semiconductor substrate | Shih-Liang Peng, Chieh-Lung Lai, Jia-Wei Pan, Chang-Lun Lu | 2018-02-20 |
| 9875949 | Electronic package having circuit structure with plurality of metal layers, and fabrication method thereof | Hsiao-Chun Huang, Hsien-Wen Chen, Guang-Hwa Ma | 2018-01-23 |
| 9754868 | Substrate structure, electronic package and method for fabricating the electronic package | Ching-Wen Chiang, Hsin-Chih Wang, Chih-Yuan Shih | 2017-09-05 |
| 9735075 | Electronic module and fabrication method thereof | Lu-Yi Chen, Chang-Lun Lu | 2017-08-15 |
| 9607974 | Package structure and fabrication method thereof | Chun-Tang Lin, Yi-Che Lai, Hong-Da Chang, Hung-Wen Liu, Yi-Wei Liu +1 more | 2017-03-28 |
| 9601403 | Electronic package and fabrication method thereof | Lu-Yi Chen, Guang-Hwa Ma, Chang-Lun Lu | 2017-03-21 |
| 8907228 | Circuit structure of electronic device and its manufacturing method | Wen-Fu Huang, Chen Cheng, Meng-Hsueh Wu | 2014-12-09 |
| 8592794 | Resistance random access memory element and method for making the same | Ting-Chang Chang, Po-Chun Yang, Yu-Shih Lin, Fu-Yen Jian | 2013-11-26 |
| 8431399 | Method to restore cartilaginous phenotype of chondrocytes after cultured and expanded in vitro | Yu-Hui Tsai, Li-Hsuan Chiu, Chin-Chean Wong, Wen-Fu Lai | 2013-04-30 |
| 8427879 | Method for enabling a SONOS transistor to be used as both a switch and a memory | Ting-Chang Chang, Te-Chih Chen, Fu-Yen Jian, Yong-En Syu | 2013-04-23 |
| 8208307 | Operation method of memory device | Ting-Chang Chang, Fu-Yen Jian, Te-Chih Chen | 2012-06-26 |
| 7835192 | Method for programming a nonvolatile memory | Ting-Chang Chang, Fu-Yen Jian | 2010-11-16 |