Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046494 | Chip matching system and method thereof | Wu-Hung Yen, Yi-Hsien Huang, Shu-Hua Chen, Shou-Qi Chang | 2024-07-23 |
| 11973014 | Method of manufacturing substrate structure with filling material formed in concave portion | Chang-Fu Lin, Chin-Tsai Yao, Fu-Tang Huang | 2024-04-30 |
| 11532495 | Chip matching system and method thereof | Wu-Hung Yen, Yi-Hsien Huang, Shu-Hua Chen, Shou-Qi Chang | 2022-12-20 |
| 11527491 | Method for fabricating substrate structure | Po-Hao Wang, Shou-Qi Chang, Yu-Hsiang Hsieh | 2022-12-13 |
| 11227842 | Electronic package and substrate structure having chamfers | Po-Hao Wang, Chang-Fu Lin, Bo-Hao Chang | 2022-01-18 |
| 11056442 | Substrate structure, electronic package having the same, and method for fabricating the same | Po-Hao Wang, Shou-Qi Chang, Yu-Hsiang Hsieh | 2021-07-06 |
| 10763223 | Substrate structure having chamfers | Po-Hao Wang, Chang-Fu Lin, Bo-Hao Chang | 2020-09-01 |
| 10522453 | Substrate structure with filling material formed in concave portion | Chang-Fu Lin, Chin-Tsai Yao, Fu-Tang Huang | 2019-12-31 |
| 10403567 | Fabrication method of electronic package | Yan-Heng Chen, Mu-Hsuan Chan, Chieh-Yuan Chi | 2019-09-03 |
| 9899303 | Electronic package and fabrication method thereof | Yan-Heng Chen, Mu-Hsuan Chan, Chieh-Yuan Chi | 2018-02-20 |
| 9842758 | Package structure and fabrication method thereof | Yan-Heng Chen, Chieh-Yuan Chi | 2017-12-12 |
| 9754898 | Semiconductor package and fabrication method thereof | Mu-Hsuan Chan, Wan-Ting Chen, Yi-Che Lai | 2017-09-05 |
| 9627226 | Fabrication method of semiconductor package | Yi-Che Lai | 2017-04-18 |
| 9607974 | Package structure and fabrication method thereof | Shih-Ching Chen, Yi-Che Lai, Hong-Da Chang, Hung-Wen Liu, Yi-Wei Liu +1 more | 2017-03-28 |
| 9607941 | Conductive via structure and fabrication method thereof | Yan-Heng Chen, Chieh-Yuan Chi, Mu-Hsuan Chan | 2017-03-28 |
| 9548220 | Method of fabricating semiconductor package having an interposer structure | Kuan-Wei Chuang, Yi-Chian Liao, Yi-Che Lai | 2017-01-17 |
| 9515040 | Package structure and fabrication method thereof | Yan-Heng Chen, Mu-Hsuan Chan, Chieh-Yuan Chi | 2016-12-06 |
| 9418874 | Method of fabricating semiconductor package | Wan-Ting Chen, Mu-Hsuan Chan, Yi-Chian Liao, Yi-Che Lai | 2016-08-16 |
| 9397081 | Fabrication method of semiconductor package having embedded semiconductor elements | Yan-Heng Chen, Yan-Yi Liao, Hung-Wen Liu, Chieh-Yuan Chi, Hsi-Chang Hsu | 2016-07-19 |
| 9349705 | Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers | Chien-Feng Chan, Mu-Hsuan Chan, Yi-Che Lai | 2016-05-24 |
| 9337061 | Fabrication method of semiconductor package | Yan-Heng Chen, Mu-Hsuan Chan, Chieh-Yuan Chi, Yan-Yi Liao | 2016-05-10 |
| 9324582 | Semiconductor package and fabrication method thereof | Yi-Che Lai | 2016-04-26 |
| 9269693 | Fabrication method of semiconductor package | Chien-Feng Chan, Yi-Che Lai | 2016-02-23 |
| 9257381 | Semiconductor package, and interposer structure of the semiconductor package | Kuan-Wei Chuang, Yi-Chian Liao, Yi-Che Lai | 2016-02-09 |
| 9224646 | Method for fabricating semiconductor package | Yan-Heng Chen, Chieh-Yuan Chi, Hung-Wen Liu | 2015-12-29 |