Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11418002 | Electronic package and method for fabricating the same | Kong-Toon Ng | 2022-08-16 |
| 11164755 | Electronic package and method for fabricating the same | Yung-Ta Li, Kong-Toon Ng, Chang-Fu Lin | 2021-11-02 |
| 9548220 | Method of fabricating semiconductor package having an interposer structure | Kuan-Wei Chuang, Chun-Tang Lin, Yi-Che Lai | 2017-01-17 |
| 9418874 | Method of fabricating semiconductor package | Wan-Ting Chen, Mu-Hsuan Chan, Chun-Tang Lin, Yi-Che Lai | 2016-08-16 |
| 9257381 | Semiconductor package, and interposer structure of the semiconductor package | Kuan-Wei Chuang, Chun-Tang Lin, Yi-Che Lai | 2016-02-09 |
| 9087780 | Semiconductor package and method of fabricating the same | Wan-Ting Chen, Mu-Hsuan Chan, Chun-Tang Lin, Yi-Che Lai | 2015-07-21 |
| 8829687 | Semiconductor package and fabrication method thereof | Mu-Hsuan Chan, Wan-Ting Chen, Chun-Tang Lin, Yi-Chi Lai | 2014-09-09 |