Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403567 | Fabrication method of electronic package | Yan-Heng Chen, Chun-Tang Lin, Chieh-Yuan Chi | 2019-09-03 |
| 9899303 | Electronic package and fabrication method thereof | Yan-Heng Chen, Chun-Tang Lin, Chieh-Yuan Chi | 2018-02-20 |
| 9768140 | Method for fabricating package structure | Yan-Heng Chen, Chieh-Yuan Chi | 2017-09-19 |
| 9754898 | Semiconductor package and fabrication method thereof | Wan-Ting Chen, Chun-Tang Lin, Yi-Che Lai | 2017-09-05 |
| 9607941 | Conductive via structure and fabrication method thereof | Yan-Heng Chen, Chun-Tang Lin, Chieh-Yuan Chi | 2017-03-28 |
| 9515040 | Package structure and fabrication method thereof | Yan-Heng Chen, Chieh-Yuan Chi, Chun-Tang Lin | 2016-12-06 |
| 9418874 | Method of fabricating semiconductor package | Wan-Ting Chen, Yi-Chian Liao, Chun-Tang Lin, Yi-Che Lai | 2016-08-16 |
| 9349705 | Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers | Chien-Feng Chan, Chun-Tang Lin, Yi-Che Lai | 2016-05-24 |
| 9337061 | Fabrication method of semiconductor package | Yan-Heng Chen, Chun-Tang Lin, Chieh-Yuan Chi, Yan-Yi Liao | 2016-05-10 |
| 9087780 | Semiconductor package and method of fabricating the same | Wan-Ting Chen, Yi-Chian Liao, Chun-Tang Lin, Yi-Che Lai | 2015-07-21 |
| 8952537 | Conductive bump structure with a plurality of metal layers | Chien-Feng Chan, Chun-Tang Lin, Yi-Che Lai | 2015-02-10 |
| 8829687 | Semiconductor package and fabrication method thereof | Wan-Ting Chen, Yi-Chian Liao, Chun-Tang Lin, Yi-Chi Lai | 2014-09-09 |
| 8524049 | Method for forming metallic nitride film | Fu-Hsing Lu, Jiun-Huei Yang, Po-Lun Wu | 2013-09-03 |