Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10199341 | Substrate structure | Fang-Yu Liang, Hung-Hsien Chang, Wen-Tsung Tseng, Chen-Yu Huang | 2019-02-05 |
| 10062651 | Packaging substrate and electronic package having the same | Fang-Yu Liang, Hung-Hsien Chang, Chang-Fu Lin | 2018-08-28 |
| 10049975 | Substrate structure | Fang-Yu Liang, Hung-Hsien Chang, Wen-Tsung Tseng, Chen-Yu Huang | 2018-08-14 |
| 9899308 | Semiconductor package and method of fabricating the same | Wen-Tsung Tseng, Shih-Kuang Chiu, Mao-Hua Yeh | 2018-02-20 |
| 9875981 | Semiconductor device having conductive vias | Meng-Tsung Lee, Shih-Kuang Chiu | 2018-01-23 |
| 9754898 | Semiconductor package and fabrication method thereof | Mu-Hsuan Chan, Wan-Ting Chen, Chun-Tang Lin | 2017-09-05 |
| 9720013 | Method of fabricating a semiconductor package | Pin-Cheng Huang | 2017-08-01 |
| 9666536 | Package structure and fabrication method thereof | Yi-Wei Liu, Yan-Heng Chen, Mao-Hua Yeh, Hung-Wen Liu | 2017-05-30 |
| 9627226 | Fabrication method of semiconductor package | Chun-Tang Lin | 2017-04-18 |
| 9607939 | Semiconductor package and method of fabricating the same | Wen-Tsung Tseng, Shih-Kuang Chiu, Mao-Hua Yeh | 2017-03-28 |
| 9607974 | Package structure and fabrication method thereof | Chun-Tang Lin, Shih-Ching Chen, Hong-Da Chang, Hung-Wen Liu, Yi-Wei Liu +1 more | 2017-03-28 |
| 9548220 | Method of fabricating semiconductor package having an interposer structure | Kuan-Wei Chuang, Chun-Tang Lin, Yi-Chian Liao | 2017-01-17 |
| 9520304 | Semiconductor package and fabrication method thereof | Hong-Da Chang, Chi-Hsin Chiu, Shih-Kuang Chiu | 2016-12-13 |
| 9502333 | Semiconductor device having conductive vias | Meng-Tsung Lee, Shih-Kuang Chiu | 2016-11-22 |
| 9418874 | Method of fabricating semiconductor package | Wan-Ting Chen, Mu-Hsuan Chan, Yi-Chian Liao, Chun-Tang Lin | 2016-08-16 |
| 9349705 | Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers | Chien-Feng Chan, Mu-Hsuan Chan, Chun-Tang Lin | 2016-05-24 |
| 9324582 | Semiconductor package and fabrication method thereof | Chun-Tang Lin | 2016-04-26 |
| 9269693 | Fabrication method of semiconductor package | Chien-Feng Chan, Chun-Tang Lin | 2016-02-23 |
| 9257381 | Semiconductor package, and interposer structure of the semiconductor package | Kuan-Wei Chuang, Chun-Tang Lin, Yi-Chian Liao | 2016-02-09 |
| 9087780 | Semiconductor package and method of fabricating the same | Wan-Ting Chen, Mu-Hsuan Chan, Yi-Chian Liao, Chun-Tang Lin | 2015-07-21 |
| 8987012 | Method of testing a semiconductor package | Pin-Cheng Huang, Chun-Tang Lin, Wen-Tsung Tseng | 2015-03-24 |
| 8952528 | Semiconductor package and fabrication method thereof | Chien-Feng Chan, Chun-Tang Lin | 2015-02-10 |
| 8952537 | Conductive bump structure with a plurality of metal layers | Chien-Feng Chan, Mu-Hsuan Chan, Chun-Tang Lin | 2015-02-10 |