Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354885 | Electronic package, electronic structure and manufacturing method thereof | Yi-Ling Chen | 2025-07-08 |
| 9548220 | Method of fabricating semiconductor package having an interposer structure | Chun-Tang Lin, Yi-Chian Liao, Yi-Che Lai | 2017-01-17 |
| 9257381 | Semiconductor package, and interposer structure of the semiconductor package | Chun-Tang Lin, Yi-Chian Liao, Yi-Che Lai | 2016-02-09 |
| 8895367 | Fabrication method of semiconductor package | Jung-Pang Huang, Hui-Min Huang, Chun-Tang Lin, Yih-Jenn Jiang | 2014-11-25 |
| 8519526 | Semiconductor package and fabrication method thereof | Jung-Pang Huang, Hui-Min Huang, Chun-Tang Lin, Yih-Jenn Jiang | 2013-08-27 |