Issued Patents All Time
Showing 1–25 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400931 | Electronic package and manufacturing method thereof | Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu | 2025-08-26 |
| 12278189 | Electronic package and manufacturing method thereof | Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu | 2025-04-15 |
| 12255165 | Electronic package and carrier thereof and method for manufacturing the same | Chi-Ren Chen, Po-Yung Chang, Pei-Geng Weng, Yuan-Hung Hsu, Don-Son Jiang | 2025-03-18 |
| 12255182 | Electronic package and manufacturing method thereof | Meng-Huan Chia, Yih-Jenn Jiang, Don-Son Jiang | 2025-03-18 |
| 12176327 | Method for fabricating electronic package | Kong-Toon Ng, Hung-Ho Lee, Chee-Key Chung, Chi-Hsin Chiu | 2024-12-24 |
| 12100642 | Electronic package and fabrication method thereof | Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu | 2024-09-24 |
| 12080618 | Electronic package, heat dissipation structure and manufacturing method thereof | Yu-Lung Huang, Kuo-Hua Yu | 2024-09-03 |
| 12027484 | Electronic package and carrier thereof and method for manufacturing the same | Chi-Ren Chen, Po-Yung Chang, Pei-Geng Weng, Yuan-Hung Hsu, Don-Son Jiang | 2024-07-02 |
| 11984379 | Electronic package and manufacturing method thereof | Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu | 2024-05-14 |
| 11973014 | Method of manufacturing substrate structure with filling material formed in concave portion | Chin-Tsai Yao, Chun-Tang Lin, Fu-Tang Huang | 2024-04-30 |
| 11810862 | Electronic package and manufacturing method thereof | Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu | 2023-11-07 |
| 11792938 | Method for fabricating carrier structure | Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu | 2023-10-17 |
| 11764188 | Electronic package and manufacturing method thereof | Meng-Huan Chia, Yih-Jenn Jiang, Don-Son Jiang | 2023-09-19 |
| 11742296 | Electronic package and manufacturing method thereof | Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Don-Son Jiang +2 more | 2023-08-29 |
| 11676948 | Method for fabricating electronic package | Kong-Toon Ng, Hung-Ho Lee, Chee-Key Chung, Chi-Hsin Chiu | 2023-06-13 |
| 11605554 | Flip-chip process and bonding equipment | Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu | 2023-03-14 |
| 11532528 | Electronic package and manufacturing method thereof | Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Don-Son Jiang | 2022-12-20 |
| 11521930 | Electronic package and manufacturing method thereof | Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu | 2022-12-06 |
| 11516925 | Package stack structure and method for manufacturing the same | Han-Hung Chen, Yuan-Hung Hsu, Rung-Jeng Lin, Fu-Tang Huang | 2022-11-29 |
| 11482470 | Electronic package and fabrication method thereof | Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu | 2022-10-25 |
| 11410954 | Electronic package, manufacturing method thereof and conductive structure | Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu | 2022-08-09 |
| 11398429 | Electronic package and manufacturing method thereof | Cheng-Kai Chang, Don-Son Jiang | 2022-07-26 |
| 11380978 | Electronic package and method for fabricating the same | Shi-Min Zhou, Han-Hung Chen, Rung-Jeng Lin, Kuo-Hua Yu | 2022-07-05 |
| 11289346 | Method for fabricating electronic package | Chen-Yu Huang, Chee-Key Chung, Kong-Toon Ng, Rui-Feng Tai, Bo MA | 2022-03-29 |
| 11289794 | Electronic package | Rung-Jeng Lin, Han-Hung Chen, Shi-Min Zhou, Kuo-Hua Yu | 2022-03-29 |