Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424560 | Semiconductor chip device | Chia-Hao Cheng, Rahul Agarwal, Brett P. Wilkerson | 2025-09-23 |
| 12276850 | Fanout module integrating a photonic integrated circuit | Brett P. Wilkerson, Raja Swaminathan, Rahul Agarwal | 2025-04-15 |
| 12176327 | Method for fabricating electronic package | Hung-Ho Lee, Chee-Key Chung, Chang-Fu Lin, Chi-Hsin Chiu | 2024-12-24 |
| 11709327 | Fanout module integrating a photonic integrated circuit | Brett P. Wilkerson, Raja Swaminathan, Rahul Agarwal | 2023-07-25 |
| 11676948 | Method for fabricating electronic package | Hung-Ho Lee, Chee-Key Chung, Chang-Fu Lin, Chi-Hsin Chiu | 2023-06-13 |
| 11418002 | Electronic package and method for fabricating the same | Yi-Chian Liao | 2022-08-16 |
| 11289346 | Method for fabricating electronic package | Chen-Yu Huang, Chee-Key Chung, Chang-Fu Lin, Rui-Feng Tai, Bo MA | 2022-03-29 |
| 11164755 | Electronic package and method for fabricating the same | Yung-Ta Li, Yi-Chian Liao, Chang-Fu Lin | 2021-11-02 |
| 11056470 | Electronic package and method for fabricating the same | Hung-Ho Lee, Chee-Key Chung, Chang-Fu Lin, Chi-Hsin Chiu | 2021-07-06 |
| 10741500 | Electronic package | Chen-Yu Huang, Chee-Key Chung, Chang-Fu Lin, Rui-Feng Tai, Bo MA | 2020-08-11 |