Patents per Year
Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12424560 | Semiconductor chip device | Kong-Toon Ng, Rahul Agarwal, Brett P. Wilkerson | 2025-09-23 | |
| 12394683 | Molded semiconductor chip package with stair-step molding layer | Priyal Shah, Rahul Agarwal, Milind S. Bhagavat | 2025-08-19 | |
| 12183675 | Fan-out packages with warpage resistance | Rahul Agarwal, Milind S. Bhagavat | 2024-12-31 | $219,663,000 |
| 11742301 | Fan-out package with reinforcing rivets | Rahul Agarwal, Milind S. Bhagavat, Priyal Shah, Brett P. Wilkerson, Lei Fu | 2023-08-29 | $158,005,000 |
| 11715691 | Integrated circuit package with integrated voltage regulator | Milind S. Bhagavat, Rahul Agarwal | 2023-08-01 | $238,969,000 |
| 11309222 | Semiconductor chip with solder cap probe test pads | Lei Fu, Milind S. Bhagavat | 2022-04-19 | $202,720,000 |
| 11011466 | Integrated circuit package with integrated voltage regulator | Milind S. Bhagavat, Rahul Agarwal | 2021-05-18 | $329,838,000 |