| 12374645 |
Electronic device including dies and an interconnect coupled to the dies and processes of forming the same |
Raja Swaminathan, Brett P. Wilkerson |
2025-07-29 |
|
| 12249519 |
Molded chip package with anchor structures |
Priyal Shah, Milind S. Bhagavat, Brett P. Wilkerson, Rahul Agarwal |
2025-03-11 |
|
| 12107075 |
Hybrid bonded interconnect bridging |
Brett P. Wilkerson, Rahul Agarwal |
2024-10-01 |
$299,271,000 |
| 12089141 |
Method for quickly searching for high-RAT network, and terminal device |
Hsingyu Lung, Tianyi Hou, Hao Song |
2024-09-10 |
|
| 12026895 |
Monocular vision-based method for measuring displacement and trajectory of planar motion |
Ming Yang, Chenguang Cai, Zhihua Liu, Wen Ye, Ying Zhang +1 more |
2024-07-02 |
|
| 11898901 |
Method and system for mapping fiber optic distributed acoustic sensing measurements to particle motion |
Weichang Li |
2024-02-13 |
|
| 11828902 |
Multi-scale three-dimensional (3D) engineering geological model construction system and method |
Bowen Zheng, Shengwen Qi, Zhendong Cui, Rixiang Zhu, Bo Wan +12 more |
2023-11-28 |
|
| 11742301 |
Fan-out package with reinforcing rivets |
Rahul Agarwal, Milind S. Bhagavat, Priyal Shah, Chia-Hao Cheng, Brett P. Wilkerson |
2023-08-29 |
$158,005,000 |
| 11676940 |
Hybrid bonded interconnect bridging |
Brett P. Wilkerson, Rahul Agarwal |
2023-06-13 |
$166,732,000 |
| 11676924 |
Semiconductor chip with reduced pitch conductive pillars |
Priyal Shah, Milind S. Bhagavat |
2023-06-13 |
$166,732,000 |
| 11382255 |
Method and system for storing emission rights for point and nonpoint source pollution based on internet of things |
Yanhong Ren, Wenxiang Cai, Zhou Zhou, Yun Huang, Aiju You +2 more |
2022-07-12 |
|
| 11367628 |
Molded chip package with anchor structures |
Priyal Shah, Milind S. Bhagavat, Brett P. Wilkerson, Rahul Agarwal |
2022-06-21 |
$1,357,635,000 |
| 11309222 |
Semiconductor chip with solder cap probe test pads |
Milind S. Bhagavat, Chia-Hao Cheng |
2022-04-19 |
$202,720,000 |
| 10995239 |
Polishing fluid for improving surfaces formed by fused deposition molding with abs and method of preparing same |
Feng Xu, Yan Liu, Jipeng Zheng, Benjun Yu |
2021-05-04 |
|
| 10943880 |
Semiconductor chip with reduced pitch conductive pillars |
Priyal Shah, Milind S. Bhagavat |
2021-03-09 |
$152,021,000 |
| 10903168 |
Multi-RDL structure packages and methods of fabricating the same |
Milind S. Bhagavat, Farshad Ghahghahi |
2021-01-26 |
$305,716,000 |
| 10798752 |
Method and device for executing emergency call |
Hui Jin, Bo Zhang, Xianglei Xin, Xiaoyan Duan |
2020-10-06 |
|
| 10672712 |
Multi-RDL structure packages and methods of fabricating the same |
Milind S. Bhagavat, Farshad Ghahghahi |
2020-06-02 |
$45,689,000 |
| 10510721 |
Molded chip combination |
Milind S. Bhagavat, Ivor G. Barber, Chia-Ken Leong, Rahul Agarwal |
2019-12-17 |
$28,855,000 |
| 10142264 |
Techniques for integration of blade switches with programmable fabric |
Rajesh Babu Nataraja, Shyam Kapadia, Nilesh Shah |
2018-11-27 |
$34,742,000 |
| 9989481 |
Rapid microwave phase detection with a solid state device |
Can-Ming Hu, Yongsheng Gui |
2018-06-05 |
|
| 9449907 |
Stacked semiconductor chips packaging |
Frank Kuechenmeister, Michael Z. Su |
2016-09-20 |
$5,529,000 |
| 8723314 |
Semiconductor workpiece with backside metallization and methods of dicing the same |
Michael Z. Su, Edward S. Alcid |
2014-05-13 |
$1,755,000 |
| 8709372 |
Carbon nanotube fiber spun from wetted ribbon |
Yuntian T. Zhu, Paul N. Arendt, Xiefei Zhang, Qingwen Li, Lianxi Zheng |
2014-04-29 |
|
| 8691626 |
Semiconductor chip device with underfill |
Michael Z. Su, Gamal Refai-Ahmed, Bryan Black |
2014-04-08 |
$3,686,000 |
