Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374645 | Electronic device including dies and an interconnect coupled to the dies and processes of forming the same | Raja Swaminathan, Brett P. Wilkerson | 2025-07-29 |
| 12249519 | Molded chip package with anchor structures | Priyal Shah, Milind S. Bhagavat, Brett P. Wilkerson, Rahul Agarwal | 2025-03-11 |
| 12107075 | Hybrid bonded interconnect bridging | Brett P. Wilkerson, Rahul Agarwal | 2024-10-01 |
| 12089141 | Method for quickly searching for high-RAT network, and terminal device | Hsingyu Lung, Tianyi Hou, Hao Song | 2024-09-10 |
| 12026895 | Monocular vision-based method for measuring displacement and trajectory of planar motion | Ming Yang, Chenguang Cai, Zhihua Liu, Wen Ye, Ying Zhang +1 more | 2024-07-02 |
| 11898901 | Method and system for mapping fiber optic distributed acoustic sensing measurements to particle motion | Weichang Li | 2024-02-13 |
| 11828902 | Multi-scale three-dimensional (3D) engineering geological model construction system and method | Bowen Zheng, Shengwen Qi, Zhendong Cui, Rixiang Zhu, Bo Wan +12 more | 2023-11-28 |
| 11742301 | Fan-out package with reinforcing rivets | Rahul Agarwal, Milind S. Bhagavat, Priyal Shah, Chia-Hao Cheng, Brett P. Wilkerson | 2023-08-29 |
| 11676940 | Hybrid bonded interconnect bridging | Brett P. Wilkerson, Rahul Agarwal | 2023-06-13 |
| 11676924 | Semiconductor chip with reduced pitch conductive pillars | Priyal Shah, Milind S. Bhagavat | 2023-06-13 |
| 11382255 | Method and system for storing emission rights for point and nonpoint source pollution based on internet of things | Yanhong Ren, Wenxiang Cai, Zhou Zhou, Yun Huang, Aiju You +2 more | 2022-07-12 |
| 11367628 | Molded chip package with anchor structures | Priyal Shah, Milind S. Bhagavat, Brett P. Wilkerson, Rahul Agarwal | 2022-06-21 |
| 11309222 | Semiconductor chip with solder cap probe test pads | Milind S. Bhagavat, Chia-Hao Cheng | 2022-04-19 |
| 10995239 | Polishing fluid for improving surfaces formed by fused deposition molding with abs and method of preparing same | Feng Xu, Yan Liu, Jipeng Zheng, Benjun Yu | 2021-05-04 |
| 10943880 | Semiconductor chip with reduced pitch conductive pillars | Priyal Shah, Milind S. Bhagavat | 2021-03-09 |
| 10903168 | Multi-RDL structure packages and methods of fabricating the same | Milind S. Bhagavat, Farshad Ghahghahi | 2021-01-26 |
| 10798752 | Method and device for executing emergency call | Hui Jin, Bo Zhang, Xianglei Xin, Xiaoyan Duan | 2020-10-06 |
| 10672712 | Multi-RDL structure packages and methods of fabricating the same | Milind S. Bhagavat, Farshad Ghahghahi | 2020-06-02 |
| 10510721 | Molded chip combination | Milind S. Bhagavat, Ivor G. Barber, Chia-Ken Leong, Rahul Agarwal | 2019-12-17 |
| 10142264 | Techniques for integration of blade switches with programmable fabric | Rajesh Babu Nataraja, Shyam Kapadia, Nilesh Shah | 2018-11-27 |
| 9989481 | Rapid microwave phase detection with a solid state device | Can-Ming Hu, Yongsheng Gui | 2018-06-05 |
| 9449907 | Stacked semiconductor chips packaging | Frank Kuechenmeister, Michael Z. Su | 2016-09-20 |
| 8723314 | Semiconductor workpiece with backside metallization and methods of dicing the same | Michael Z. Su, Edward S. Alcid | 2014-05-13 |
| 8709372 | Carbon nanotube fiber spun from wetted ribbon | Yuntian T. Zhu, Paul N. Arendt, Xiefei Zhang, Qingwen Li, Lianxi Zheng | 2014-04-29 |
| 8691626 | Semiconductor chip device with underfill | Michael Z. Su, Gamal Refai-Ahmed, Bryan Black | 2014-04-08 |