Issued Patents All Time
Showing 25 most recent of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414226 | Electronic device with below PCB thermal management | Paul T. Artman, Mark H. Steinke | 2025-09-09 |
| 12324101 | Frame for coupling of a thermal management device to a printed circuit board | Suresh Ramalingam, Aslam Yehia, Chi-Yi Chao, Md Malekkul ISLAM, Hoa Do | 2025-06-03 |
| 12315781 | Heat spreader for a semiconductor package | Suresh Ramalingam | 2025-05-27 |
| 12094853 | Semiconductor chip with redundant thru-silicon-vias | Bryan Black, Michael Z. Su, Joe Siegel, Seth Prejean | 2024-09-17 |
| 11769710 | Heterogeneous integration module comprising thermal management apparatus | Suresh Ramalingam, Ken Chang, Mayank Raj, Chuan Xie, Yohan Frans | 2023-09-26 |
| 11605886 | Radome with integrated passive cooling | Chi-Yi Chao, Lik Tsang, Jens Weis, Brendan Farley, Anthony Torza +1 more | 2023-03-14 |
| 11488887 | Thermal enablement of dies with impurity gettering | Suresh Ramalingam, Boon Yong Ang, Toshiyuki Hisamura, Suresh Parameswaran, Scott McCann +1 more | 2022-11-01 |
| 11488936 | Stacked silicon package assembly having vertical thermal management | Suresh Ramalingam, Jaspreet S. Gandhi, Cheang-Whang Chang | 2022-11-01 |
| 11476556 | Remote active cooling heat exchanger and antenna system with the same | Mohsen H. Mardi, Suresh Ramalingam, Volker Aue | 2022-10-18 |
| 11469212 | Semiconductor chip with redundant thru-silicon-vias | Bryan Black, Michael Z. Su, Joe Siegel, Seth Prejean | 2022-10-11 |
| 11373929 | Thermal heat spreader plate for electronic device | Chi-Yi Chao, Suresh Ramalingam, Hoa Do, Anthony Torza, Brian D. Philofsky +1 more | 2022-06-28 |
| 11355412 | Stacked silicon package assembly having thermal management | Jaspreet S. Gandhi, Henley Liu, Myongseob Kim, Tien-Yu Lee, Suresh Ramalingam +1 more | 2022-06-07 |
| 11328976 | Three-dimensional thermal management apparatuses for electronic devices | Chi-Yi Chao, Suresh Ramalingam, Hoa Do, Anthony Torza, Brian D. Philofsky | 2022-05-10 |
| 11330738 | Force balanced package mounting | Chi-Yi Chao, Huayan Wang, Suresh Ramalingam, Volker Aue | 2022-05-10 |
| 11246211 | Micro device with through PCB cooling | Nagadeven Karunakaran, Hoa Do, Suresh Ramalingam | 2022-02-08 |
| 11195780 | Stacked silicon package assembly having thermal management using phase change material | Jaspreet S. Gandhi, Suresh Ramalingam | 2021-12-07 |
| 11145566 | Stacked silicon package assembly having thermal management | Suresh Ramalingam, Jaspreet S. Gandhi, Cheang-Whang Chang | 2021-10-12 |
| 10770364 | Chip scale package (CSP) including shim die | Hong Shi, Suresh Ramalingam, Siow Chek Tan | 2020-09-08 |
| 10741998 | Thermal-mechanical adjustment for laser system | Sandip Maity, Ying Zhou, David Peter Robinson | 2020-08-11 |
| 10720377 | Electronic device apparatus with multiple thermally conductive paths for heat dissipation | Ho Hyung Lee, Hui-Wen Lin, Henley Liu, Suresh Ramalingam | 2020-07-21 |
| RE48015 | Interconnect devices for electronic packaging assemblies | David Mulford Shaddock, Arun Virupaksha Gowda, John Anthony Vogel, Christian M. Giovanniello | 2020-05-26 |
| 10629512 | Integrated circuit die with in-chip heat sink | Hong-Tsz Pan, Jonathan Chang, Nui Chong, Henley Liu, Suresh Ramalingam | 2020-04-21 |
| 10527670 | Testing system for lid-less integrated circuit packages | Ivor G. Barber, Suresh Ramalingam, Jaspreet S. Gandhi, Tien-Yu Lee, Henley Liu +2 more | 2020-01-07 |
| 10529645 | Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management | Jaspreet S. Gandhi, Henley Liu, Tien-Yu Lee, Myongseob Kim, Ferdinand F. Fernandez +2 more | 2020-01-07 |
| 10262920 | Stacked silicon package having a thermal capacitance element | Suresh Ramalingam, Brian D. Philofsky, Anthony Torza | 2019-04-16 |