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Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
BA

Boon Yong Ang — 33 Patents

AMD: 27 patents #367 of 9,280Top 4%
SLSpansion Llc.: 4 patents #203 of 769Top 30%
Globalfoundries: 1 patents #2,221 of 4,424Top 55%
XIXilinix: 1 patents #2 of 23Top 9%
Sunnyvale, CA: #677 of 14,302 inventorsTop 5%
California: #15,252 of 386,348 inventorsTop 4%
Overall (All Time): #105,480 of 4,157,543Top 3%
33 Patents All Time
Boon Yong Ang has been granted 33 US patents while listed as an inventor at AMD. The first was granted in 2001 and the most recent in November 2022. Boon Yong Ang ranks #105,480 of 4,157,543 US inventors in our database (top 2.5%). Patent records list Boon Yong Ang in Sunnyvale, CA, US.

Patents per Year

Patents granted per year, 2001 to 2022Bar chart with a peak of 5 patents in 2010.peak 52001: 1 patents20012003: 2 patents2004: 3 patents20042005: 2 patents2006: 2 patents20062007: 3 patents2008: 1 patents20082009: 2 patents2010: 5 patents20102011: 2 patents2012: 2 patents20122013: 1 patents2014: 1 patents20142019: 2 patents2020: 1 patents20202021: 1 patents2022: 2 patents2022

Issued Patents All Time

Showing 1–25 of 33 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11488887 Thermal enablement of dies with impurity gettering Gamal Refai-Ahmed, Suresh Ramalingam, Toshiyuki Hisamura, Suresh Parameswaran, Scott McCann +1 more 2022-11-01
11379580 Mixed storage of data fields James D. Wesselkamper, Edward S. Peterson, Jason J. Moore, Steven E. McNeil, Roger D. Flateau, Jr. +1 more 2022-07-05
11073550 Test vehicle for package testing Yuqing Gong, Suresh Parameswaran 2021-07-27 $80,530,000
10620644 Systems and methods for on-die heat generation and temperature sensing Suresh Parameswaran, Sarayanan Balakrishnan 2020-04-14 $21,268,000
10302504 On-die temperature sensing and digitization system Suresh Parameswaran, Ankur Jain 2019-05-28 $41,882,000
10262911 Circuit for and method of testing bond connections between a first die and a second die Yuqing Gong, Henley Liu, Myongseob Kim, Suresh Parameswaran, Cheang-Whang Chang 2019-04-16 $53,960,000
8810269 Method of testing a semiconductor structure Yuqing Gong, Henley Liu, Myongseob Kim, Suresh Parameswaran, Cheang-Whang Chang 2014-08-19 $15,329,000
8564023 Integrated circuit with MOSFET fuse element Hsung Jai Im, Sunhom Paak 2013-10-22 $21,521,000
8143695 Contact fuse one time programmable memory Serhii Tumakha, Amit Ghia 2012-03-27 $2,711,000
8102019 Electrically programmable diffusion fuse Serhii Tumakha, Amit Ghia, Jan Lodewijk de Jong 2012-01-24 $8,017,000
7923785 Field effect transistor having increased carrier mobility Qi Xiang, Jung-Suk Goo 2011-04-12 $5,867,000
7923811 Electronic fuse cell with enhanced thermal gradient Hsung Jai Im, Sunhom Paak 2011-04-12 $10,435,000
7839693 Method of fabricating CMOS-compatible non-volatile memory cell with lateral inter-poly programming layer Sunhom Paak, Hsung Jai Im, Daniel Gitlin 2010-11-23 $3,199,000
7834659 Multi-step programming of E fuse cells Hsung Jai Im, Sunhom Paak 2010-11-16 $18,992,000
7724600 Electronic fuse programming current generator with on-chip reference Hsung Jai Im, Sunhom Paak 2010-05-25 $2,818,000
7710813 Electronic fuse array Hsung Jai Im, Sunhom Paak, Raymond C. Pang, Serhii Tumakha 2010-05-04 $10,365,000
7688639 CMOS-compatible non-volatile memory cell with lateral inter-poly programming layer Sunhom Paak, Hsung Jai Im, Daniel Gitlin 2010-03-30 $14,323,000
7598749 Integrated circuit with fuse programming damage detection Sunhom Paak, Hsung Jai Im, Kwansuhk Oh, Raymond C. Pang 2009-10-06 $6,100,000
7567449 One-time-programmable logic bit with multiple logic elements Sunhom Paak, Hsung Jai Im 2009-07-28 $9,789,000
7381620 Oxygen elimination for device processing Hidehiko Shiraiwa, Simon S. Chan, Harpreet Sachar, Mark Randolph 2008-06-03 $3,474,000
7312625 Test circuit and method of use thereof for the manufacture of integrated circuits Sunhom Paak, Hsung Jai Im, Jan Lodewijk de Jong 2007-12-25
7294888 CMOS-compatible non-volatile memory cell with lateral inter-poly programming layer Sunhom Paak, Hsung Jai Im, Daniel Gitlin 2007-11-13 $8,685,000
7242102 Bond pad structure for copper metallization having increased reliability and method for fabricating same Inkuk Kang, Hiroyuki Kinoshita, Hajime Wada, Simon S. Chan, Cinti X. Chen 2007-07-10 $13,776,000
7122465 Method for achieving increased control over interconnect line thickness across a wafer and between wafers Cinti X. Chen, Simon S. Chan, Inkuk Kang 2006-10-17 $15,100,000
6995564 Method and system for locating chip-level defects through emission imaging of a semiconductor device Mehrdad Mahanpour, Mohammed Massoodi 2006-02-07 $12,481,000