Cinti X. Chen — 16 Patents at AMD

Cinti X. Chen has been granted 16 US patents while listed as an inventor at AMD. The first was granted in 2004 and the most recent in September 2023. Cinti X. Chen ranks #284,196 of 4,157,543 US inventors in our database (top 6.8%). Patent records list Cinti X. Chen in Fremont, CA, US.

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11762958	Markov decision process based recipe generation for multi-chip apparatus	Ran Zhou, Xiao-Yu Li	2023-09-19
9236367	Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product	Myongseob Kim, Xiao-Yu Li, Mohsen H. Mardi	2016-01-12	$4,795,000
9214433	Charge damage protection on an interposer for a stacked die assembly	Qi Xiang, Xiao-Yu Li, Glenn O'Rourke	2015-12-15	$13,307,000
8987009	Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product	Myongseob Kim, Xiao-Yu Li, Mohsen H. Mardi	2015-03-24	$10,728,000
8402412	Increasing circuit speed and reducing circuit leakage by utilizing a local surface temperature effect	Xiao-Yu Li, Joe W. Zhao	2013-03-19	$5,568,000
8311659	Identifying non-randomness in integrated circuit product yield	Joe W. Zhao	2012-11-13	$4,352,000
8166445	Estimating Icc current temperature scaling factor of an integrated circuit	Yongjun Zheng, Joe W. Zhao	2012-04-24	$12,226,000
8022468	Ultraviolet radiation blocking interlayer dielectric	Minh Van Ngo, Wenmei Li, Jeffrey A. Shields, Ning Cheng, Angela T. Hui	2011-09-20
7977218	Thin oxide dummy tiling as charge protection	Yi He, Wenmei Li, Zhizheng Liu, Ming Sang Kwan, Yu Sun +1 more	2011-07-12	$1,106,000
7341956	Disposable hard mask for forming bit lines	Hirokazu Tokuno, Minh Van Ngo, Angela T. Hui	2008-03-11
7242102	Bond pad structure for copper metallization having increased reliability and method for fabricating same	Inkuk Kang, Hiroyuki Kinoshita, Boon Yong Ang, Hajime Wada, Simon S. Chan	2007-07-10	$13,776,000
7238571	Non-volatile memory device with increased reliability	Hirokazu Tokuno, Wenmei Li, Ning Cheng, Minh Van Ngo, Angela T. Hui	2007-07-03
7122465	Method for achieving increased control over interconnect line thickness across a wafer and between wafers	Boon Yong Ang, Simon S. Chan, Inkuk Kang	2006-10-17	$15,100,000
6974989	Structure and method for protecting memory cells from UV radiation damage and UV radiation-induced charging during backend processing	Boon Yong Ang, Hajime Wada, Sameer Haddad, Inkuk Kang	2005-12-13
6765254	Structure and method for preventing UV radiation damage and increasing data retention in memory cells	Angela T. Hui, Minh Van Ngo, Ning Cheng, Jaeyong Park, Jean Y. Yang +3 more	2004-07-20	$1,607,000
6744105	Memory array having shallow bit line with silicide contact portion and method of formation	Hiroyuki Kinoshita, Jeff P. Erhardt, Weidong Qian, Jean Y. Yang	2004-06-01	$2,717,000

Cinti X. Chen — 16 Patents

Issued Patents All Time

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