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2016-01-12 |
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Charge damage protection on an interposer for a stacked die assembly |
Qi Xiang, Xiao-Yu Li, Glenn O'Rourke |
2015-12-15 |
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Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product |
Myongseob Kim, Xiao-Yu Li, Mohsen H. Mardi |
2015-03-24 |
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Xiao-Yu Li, Joe W. Zhao |
2013-03-19 |
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Identifying non-randomness in integrated circuit product yield |
Joe W. Zhao |
2012-11-13 |
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Yongjun Zheng, Joe W. Zhao |
2012-04-24 |
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Ultraviolet radiation blocking interlayer dielectric |
Minh Van Ngo, Wenmei Li, Jeffrey A. Shields, Ning Cheng, Angela T. Hui |
2011-09-20 |
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Thin oxide dummy tiling as charge protection |
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2008-03-11 |
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Bond pad structure for copper metallization having increased reliability and method for fabricating same |
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Hirokazu Tokuno, Wenmei Li, Ning Cheng, Minh Van Ngo, Angela T. Hui |
2007-07-03 |
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2006-10-17 |
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2005-12-13 |
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Structure and method for preventing UV radiation damage and increasing data retention in memory cells |
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2004-06-01 |