Issued Patents All Time
Showing 25 most recent of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12048083 | Micro device with adaptable thermal management device | — | 2024-07-23 |
| 11476556 | Remote active cooling heat exchanger and antenna system with the same | Gamal Refai-Ahmed, Suresh Ramalingam, Volker Aue | 2022-10-18 |
| 11043484 | Method and apparatus of package enabled ESD protection | Hong Shi, James Karp, Siow Chek Tan, Martin L. Voogel, Suresh Ramalingam +1 more | 2021-06-22 |
| 10838018 | Multiple insertion testing of test socket | David M. Mahoney, Joseph M. Juane, Owais E. Malik | 2020-11-17 |
| 10823759 | Test system and method of testing a wafer for integrated circuit devices | Lik Huay Lim, Andy Widjaja, King Yon Lew, Xuejing Che | 2020-11-03 |
| 10783308 | Method of assigning contact elements associated with an integrated circuit device | Lik Huay Lim, Andy Widjaja, King Yon Lew, Xuejing Che | 2020-09-22 |
| 10665579 | Chip package assembly with power management integrated circuit and integrated circuit die | Stephen M. Trimberger, David M. Mahoney | 2020-05-26 |
| 10613137 | Probe head securing mechanism for probe assembly | Lik Huay Lim, King Yon Lew, Andy Widjaja | 2020-04-07 |
| 10571517 | Probe head assembly | Lik Huay Lim, King Yon Lew, Andy Widjaja | 2020-02-25 |
| 10564212 | Integrated circuit package testing system | David M. Mahoney | 2020-02-18 |
| 10539610 | Chip package test system | David M. Mahoney | 2020-01-21 |
| 10527670 | Testing system for lid-less integrated circuit packages | Gamal Refai-Ahmed, Ivor G. Barber, Suresh Ramalingam, Jaspreet S. Gandhi, Tien-Yu Lee +2 more | 2020-01-07 |
| 10520544 | Versatile testing system | — | 2019-12-31 |
| 10367279 | Pusher pin having a non-electrically conductive portion | — | 2019-07-30 |
| 10168384 | Modular testing system with versatile robot | — | 2019-01-01 |
| 10096502 | Method and apparatus for assembling and testing a multi-integrated circuit package | Gamal Refai-Ahmed, Suresh Ramalingam, Tien-Yu Lee, Ivor G. Barber, Cheang-Whang Chang +1 more | 2018-10-09 |
| 9947560 | Integrated circuit package, and methods and tools for fabricating the same | David Tan, Gamal Refai-Ahmed | 2018-04-17 |
| 9236367 | Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product | Cinti X. Chen, Myongseob Kim, Xiao-Yu Li | 2016-01-12 |
| 9123738 | Transmission line via structure | David M. Mahoney | 2015-09-01 |
| 8987009 | Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product | Cinti X. Chen, Myongseob Kim, Xiao-Yu Li | 2015-03-24 |
| 8659169 | Corner structure for IC die | David M. Mahoney | 2014-02-25 |
| 8542029 | Methods and apparatus for testing of integrated circuits | — | 2013-09-24 |
| 8493071 | Shorted test structure | Joseph M. Juane | 2013-07-23 |
| 8310253 | Hybrid probe card | Elvin P. Dang | 2012-11-13 |
| 8269518 | Method and apparatus for preventing probe card oxidation | Elvin P. Dang | 2012-09-18 |