Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11393697 | Semiconductor chip gettering | Rahul Agarwal, Milind S. Bhagavat, Venkatachalam Valliappan, Yuen Ting Cheng, Guan Sin Chok | 2022-07-19 |
| 10825692 | Semiconductor chip gettering | Rahul Agarwal, Milind S. Bhagavat, Venkatachalam Valliappan, Yuen Ting Cheng, Guan Sin Chok | 2020-11-03 |
| 10527670 | Testing system for lid-less integrated circuit packages | Gamal Refai-Ahmed, Suresh Ramalingam, Jaspreet S. Gandhi, Tien-Yu Lee, Henley Liu +2 more | 2020-01-07 |
| 10529645 | Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management | Jaspreet S. Gandhi, Henley Liu, Tien-Yu Lee, Gamal Refai-Ahmed, Myongseob Kim +2 more | 2020-01-07 |
| 10510721 | Molded chip combination | Milind S. Bhagavat, Lei Fu, Chia-Ken Leong, Rahul Agarwal | 2019-12-17 |
| 10319606 | Chip package assembly with enhanced interconnects and method for fabricating the same | Jaspreet S. Gandhi, Tien-Yu Lee, Henley Liu, Suresh Ramalingam | 2019-06-11 |
| 10096502 | Method and apparatus for assembling and testing a multi-integrated circuit package | Gamal Refai-Ahmed, Suresh Ramalingam, Mohsen H. Mardi, Tien-Yu Lee, Cheang-Whang Chang +1 more | 2018-10-09 |
| 10043730 | Stacked silicon package assembly having an enhanced lid | Gamal Refai-Ahmed, Tien-Yu Lee, Ferdinand F. Fernandez, Suresh Ramalingam, Inderjit Singh +1 more | 2018-08-07 |
| 7829424 | Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs | Leah M. Miller, Aritharan Thurairajaratnam | 2010-11-09 |
| 7508062 | Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs | Leah M. Miller, Aritharan Thurairajaratnam | 2009-03-24 |
| 7173328 | Integrated circuit package and method having wire-bonded intra-die electrical connections | — | 2007-02-06 |
| 6943446 | Via construction for structural support | John McCormick, Kumar Nagarajan | 2005-09-13 |
| 6673708 | Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill | Zafer Kutlu | 2004-01-06 |
| 6590292 | Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill | Zafer Kutlu | 2003-07-08 |
| 5895968 | Semiconductor device assembly with minimized bond finger connections | — | 1999-04-20 |
| 5801072 | Method of packaging integrated circuits | — | 1998-09-01 |
| 5741726 | Semiconductor device assembly with minimized bond finger connections | — | 1998-04-21 |
| 5723369 | Method of flip chip assembly | — | 1998-03-03 |
| 5700723 | Method of packaging an integrated circuit | — | 1997-12-23 |
| 5604161 | Semiconductor device assembly with minimized bond finger connections | — | 1997-02-18 |
| 5545923 | Semiconductor device assembly with minimized bond finger connections | — | 1996-08-13 |