Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315853 | System packaging for cellular modem and transceiver system of heterogeneous stacking | Sidharth Dalmia | 2025-05-27 |
| 12165956 | Molded silicon on passive package | Flynn Carson, Karthik Shanmugam, Menglu Li, Raymundo M. Camenforte, Scott D. Morrison | 2024-12-10 |
| 10461066 | Structure and method for hybrid optical package with glass top cover | Seshasayee S. Ankireddi | 2019-10-29 |
| 9627573 | Optical sensor having a light emitter and a photodetector assembly directly mounted to a transparent substrate | Jerome Chandra Bhat, Dan G. Allen, Richard Ian Olsen | 2017-04-18 |
| 9443815 | Embedded die redistribution layers for active device | Kai Liu, Satbir Madra | 2016-09-13 |
| 9397027 | Sacrificial pad on semiconductor package device and method | Xiansong Chen, Yi-Sheng Anthony Sun, Satbir Madra, Yong Li Xu | 2016-07-19 |
| 9354111 | Wafer level lens in package | Nicole D. Kerness, Arkadii V. Samoilov, Jerome Chandra Bhat, Anand Chamakura, Christopher F. Edwards | 2016-05-31 |
| 9136258 | Stacked LED for optical sensor devices | Ken Jian Ming Wang, Seshasayee Gaddamraja | 2015-09-15 |
| 8841752 | Semiconductor structure and method for interconnection of integrated circuits | Raghunandan Chaware | 2014-09-23 |
| 8810028 | Integrated circuit packaging devices and methods | Nael Zohni, Ronilo Boja | 2014-08-19 |
| 8519528 | Semiconductor structure and method for interconnection of integrated circuits | Raghunandan Chaware | 2013-08-27 |
| 8410604 | Lead-free structures in a semiconductor device | Laurene Yip, Leilei Zhang | 2013-04-02 |
| 8258013 | Integrated circuit assembly having vented heat-spreader | S. Gabriel R. Dosdos, Dong Wook Kim, Kong Woo LEE | 2012-09-04 |
| 8084297 | Method of implementing a capacitor in an integrated circuit | Mukul Joshi | 2011-12-27 |
| 7791192 | Circuit for and method of implementing a capacitor in an integrated circuit | Mukul Joshi | 2010-09-07 |
| 7473583 | Integrated circuit having a lid and method of employing a lid on an integrated circuit | — | 2009-01-06 |
| 7190082 | Low stress flip-chip package for low-K silicon technology | Zafer Kutlu | 2007-03-13 |
| 7187077 | Integrated circuit having a lid and method of employing a lid on an integrated circuit | — | 2007-03-06 |
| 6963129 | Multi-chip package having a contiguous heat spreader assembly | Thomas R. Evans, Stan Mihelcic, Leah M. Miller, Edwin M. Fulcher | 2005-11-08 |
| 6943446 | Via construction for structural support | John McCormick, Ivor G. Barber | 2005-09-13 |
| 6911736 | Electrostatic discharge protection | — | 2005-06-28 |
| 6825066 | Stiffener design | Yogendra Ranade, Anand Govind, Farshad Ghahghahi, Aritharan Thurairajaratnam | 2004-11-30 |
| 6806119 | Method of balanced coefficient of thermal expansion for flip chip ball grid array | Zafer Kutlu, Shirish Shah | 2004-10-19 |
| 6639321 | Balanced coefficient of thermal expansion for flip chip ball grid array | Zafer Kutlu, Shirish Shah | 2003-10-28 |
| 6519844 | Overmold integrated circuit package | Seng-Sooi Lim, Chok J. Chia | 2003-02-18 |