Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7463062 | Structured integrated circuit device | Zvi Or-Bach, Ze'ev Wurman, Adam E. Levinthal, Laurence H. Cooke | 2008-12-09 |
| 7117467 | Methods for optimizing package and silicon co-design of integrated circuit | Anwar Ali, James G. Monthie | 2006-10-03 |
| 7098528 | Embedded redistribution interposer for footprint compatible chip package conversion | Ronnie Vasishta | 2006-08-29 |
| 6963129 | Multi-chip package having a contiguous heat spreader assembly | Thomas R. Evans, Leah M. Miller, Kumar Nagarajan, Edwin M. Fulcher | 2005-11-08 |